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參數(shù)資料
| 型號(hào)： | HSMB-CXXX |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | Surface Mount Chip LEDs |
| 中文描述： | 表面貼裝芯片LED |
| 文件頁(yè)數(shù)： | 8/9頁(yè) |
| 文件大?。?/td> | 162K |
| 代理商： | HSMB-CXXX |
8
Figure 16. Tape Leader and Trailer Dimensions.
Notes:
1.
Alldimensionsinmillimeters(inches).
2.Toleranceis±0.1mm(±0.004in.)unlessotherwisespecified.
Figure 15. Tape Dimensions.
fig 14
END
START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
± 0.10 (± 0.004)
PART NUMBER
CATHODE
DIM. B
± 0.10 (± 0.004)
DIM. C
± 0.10 (± 0.004)
HSMx-C170 SERIES 2.30 (0.091) 1.45 (0.057) 0.95 (0.037)
HSMx-C110 SERIES 3.40 (0.134) 1.70 (0.067) 1.20 (0.047)
HSMx-C150 SERIES 3.50 (0.138) 1.88 (0.074) 1.27 (0.050)
HSMx-C190 SERIES 1.80 (0.071) 0.95 (0.037) 0.87 (0.034)
HSMx-C191 SERIES 1.85 (0.073) 0.88 (0.035) 0.85 (0.033)
HSMx-C110
POSITION IN
CARRIER TAPE
DIM. B
(SEE TABLE 1)
DIM. A
(SEE TABLE 1)
R 1.0 ± 0.05
(0.039 ± 0.002)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSMBJ5913B | 制造商:MICROSEMI 制造商全稱(chēng):Microsemi Corporation 功能描述:SILICON 3.0W ZENER DIOCE |
| HSMBJ5914B | 制造商:MICROSEMI 制造商全稱(chēng):Microsemi Corporation 功能描述:SILICON 3.0W ZENER DIOCE |
| HSMBJ5915B | 制造商:MICROSEMI 制造商全稱(chēng):Microsemi Corporation 功能描述:SILICON 3.0W ZENER DIOCE |
| HSMBJ5916B | 制造商:MICROSEMI 制造商全稱(chēng):Microsemi Corporation 功能描述:SILICON 3.0W ZENER DIOCE |
| HSMBJ5917B | 制造商:MICROSEMI 制造商全稱(chēng):Microsemi Corporation 功能描述:SILICON 3.0W ZENER DIOCE |
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