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參數(shù)資料
| 型號(hào)： | HSMB-CXXX |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | Surface Mount Chip LEDs |
| 中文描述： | 表面貼裝芯片LED |
| 文件頁(yè)數(shù)： | 6/9頁(yè) |
| 文件大?。?/td> | 162K |
| 代理商： | HSMB-CXXX |
6
Figure 6. Relative Intensity vs. Angle for HSMB-C170, HSMB-C190, HSMB-C150, and HSMB-C191.
HSMB-C190 fig 6
Figure 9. Recommended Soldering Pattern for HSMB-C170.
Figure 10. Recommended Soldering Pattern for HSMB-C190 and C191.
Figure 11. Recommended Soldering Pattern for HSMB-C110.
Figure 8. Recommended Pb-free Reflow Soldering Profile.
Note:
1.
Alldimensionsinmillimeters(inches).
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
HSMB-C190 fig 8
0.8 (0.031)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
HSMB-C190 fig 9
R
100
0
-90
ANGLE
80
60
50
70
20
10
30
40
90
-70
-50
-30
0
20 30
50
70
90
-20
-80
-60
-40
-10
10
40
60
80
Figure 7. Recommended reflow soldering profile.
217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
(Acc. to J-STD-020C)
10 - 30 SEC.
TIME
T
5.0 (0.200)
1.0 (0.039)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
0.9 (0.035)
0.2 (0.008)
HSSM-C110 fig 8
0.9 (0.035)
HSMB-C190 fig 7
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
T
4°C/SEC. MAX.
140-160°C
–3°C/SEC. MAX.
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