參數(shù)資料
型號: HSDL-3203
廠商: Avago Technologies Ltd.
英文描述: Small Profile Package IrDA㈢ Data Compliant Low Power 115.2 kbit/s Infrared Transceiver
中文描述: 小資料包的IrDA㈢數(shù)據(jù)兼容低功耗115.2 kbit / s的紅外收發(fā)器
文件頁數(shù): 9/19頁
文件大?。?/td> 413K
代理商: HSDL-3203
9
Moisture-Proof Packaging
All HSDL-3203 options are shipped in moisture-proof packaging. Once opened, moisture absorption begins.
Recommended Storage
Conditions
Storage Temp.
Relative Humidity
10C to 30C
Below 60% RH
Time from Unsealing to Soldering
After removal from the bag, the
parts should be soldered within
two days if stored at the recom-
mended storage conditions. If
times longer than two days are
needed, the parts must be stored
in a dry box.
Figure 12. Baking conditions chart.
Baking Conditions
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Packaging
In Reels
In Bulk
Temp.
60C
100C
125C
150C
Time
48 hours
4 hours
2 hours
1 hour
Baking should only be done once.
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
PACKAGE IS
OPENED (UNSEALED)
ENVIRONMENT
LESS THAN 25
°
C,
AND LESS THAN
60% RH
PACKAGE IS
OPENED MORE
THAN 2 DAYS
PERFORM RECOMMENDED
BAKING CONDITIONS
NO BAKING
IS NECESSARY
YES
NO
YES
NO
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相關代理商/技術參數(shù)
參數(shù)描述
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