參數(shù)資料
型號(hào): HSDL-3021
廠商: Avago Technologies Ltd.
英文描述: IrDA㈢ Data Compliant Low Power 4.0 Mbit/s with Remote Control Infrared Transceiver
中文描述: 紅外線㈢數(shù)據(jù)兼容低功耗4.0 Mbit / s的紅外遙控器
文件頁數(shù): 3/26頁
文件大?。?/td> 205K
代理商: HSDL-3021
3
I/O Pins Configuration Table
Pin
Symbol
Description
I/O Type
Notes
1
LEDA
LED Anode
Note 1
2
IOV
CC
TxD_IR
Input/Output ASIC Voltage
Note 2
3
IrDA Transmitter Data Input
Input. Active High
Note 3
4
RxD
IrDA Receive Data
Output. Active Low
Note 4
5
SD
Shutdown
Input. Active High
Note 5
6
V
CC
TxD_RC
Supply Voltage
Note 6
7
RC Transmitter Data Input
Input. Active High
Note 7
8
GND
Ground
Note 8
Shield
EMI shield
Note 9
Notes:
1. Tied through external resistor, R2, to Vled. Refer to the table below for recommended series resistor value.
2. Connect to ASIC logic controller supply voltage or V
CC
. The voltage at this pin should be equal to or less than V
CC
.
3. This pin is used to transmit serial data when SD pin is low. If held high for longer than 50
μ
s, the LED is turned off. Do NOT float this pin.
4. This pin is capable of driving a standard CMOS or TTL load. No external pull-up or pull-down resistor is required. The pin is in tri-state when the
transceiver is in shutdown mode.
5. Complete shutdown of IC and PIN diode. The pin is used for setting IR receiver bandwidth, range of IR LED current and RC drive programming mode.
Refer to section on “Bandwidth Selection Timing” and “Remote Control Drive Modes” for more information. Do NOT float this pin. ***
6. Regulated, 2.4 V to 3.6 V.
7. Logic high turns on the RC LED. If held high longer than 50
μ
s, the RC LED is turned off. Do NOT float the pin.
8. Connect to system ground.
9. Connect to system ground via a low inductance trace. For best performance, do not connect directly to the transceiver GND pin.
Recommended Application Circuit Components
Component
Recommended Value
4.7
,
±
5%, 0.25 watt
2.7
, for 2.4 < VLED
2.7 V;
3.3
, for 2.7 < VLED
3.0 V
3.9
, for 3.0 < VLED
3.3 V
4.7
, for 3.3 < VLED
3.6 V
5.6
, for 3.6 < VLED
4.2 V
10
, for 4.2 < VLED
5 V
100 nF,
±
20%, X7R Ceramic
4.7
μ
F,
±
20%, Tantalum
Note
R1
R2
CX1, CX3, CX5
1
CX2, CX4
1
Note:
1. CX1, CX2, CX3 & CX4 must be placed within 0.7 cm of HSDL-3021 to obtain optimum noise
immunity.
CAUTIONS:
The BiCMOS inherent to the design of this component increases the component’s
susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static
precautions be taken in handling and assembly of this component to prevent damage and/or
degradation which may be induced by ESD.
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