參數(shù)資料
型號(hào)： HSDL-3021
廠商： Avago Technologies Ltd.
英文描述： IrDA㈢ Data Compliant Low Power 4.0 Mbit/s with Remote Control Infrared Transceiver
中文描述： 紅外線㈢數(shù)據(jù)兼容低功耗4.0 Mbit / s的紅外遙控器
文件頁數(shù)： 12/26頁
文件大?。?/td> 205K
代理商： HSDL-3021
12
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
D
T
25
°
C to 150
°
C
150
°
C to 200
°
C
200
°
C to 260
°
C
260
°
C to 200
°
C
200
°
C to 25
°
C
>217
°
C
Maximum
D
T/
D
Time or Duration
3
°
C/s
100s to 180s
3
°
C/s
-6
°
C/s
-6
°
C/s
60s to 90s
Cool Down
Time maintained above
liquidus point, 217
°
C
Peak Temperature
Time within 5
°
C of actual
Peak Temperature
Time 25
°
C to Peak Temperature
260
°
C
–
–
20s to 40s
25
°
C to 260
°
C
8 mins
The reflow profile is a straight-line
representation of a nominal
temperature profile for a convective
reflow solder process. The
temperature profile is divided into
four process zones, each with
different
D
T/
D
time temperature
change rates, or duration. The
D
T/
D
time rates, or duration, are
detailed in the above table. The
temperatures are measured at the
component to printed circuit board
connections.
In
process zone P1
, the PC board
and HSDL-3021 pins are heated to a
temperature of 150
°
C to activate
the flux in the solder paste. The
temperature ramp up rate, R1, is
limited to 3
°
C per second to allow
for even heating of both the PC
board and HSDL-3021 pins.
Process zone P2
should be of
sufficient time duration (100 to 180
seconds) to dry the solder paste.
The temperature is raised to a level
just below the liquidus point of the
solder.
Process zone P3
is the solder
reflow zone. In zone P3, the
temperature is quickly raised above
the liquidus point of solder to 260
°
C
(500
°
F) for optimum results. The
dwell time above the liquidus point
of solder should be between 60 and
90 seconds. This is to assure proper
coalescing of the solder paste into
liquid solder and the formation of
good solder connections. Beyond
the recommended dwell time, the
intermetallic growth within the
solder connections becomes
excessive, resulting in the formation
of weak and unreliable connections.
The temperature is then rapidly
reduced to a point below the solidus
temperature of the solder to allow
the solder within the connections to
freeze solid.
Process zone P4
is the cool down
after solder freeze. The cool down
rate, R5, from the liquidus point of
the solder to 25
°
C (77
°
F) should not
exceed 6
°
C per second maximum.
This limitation is necessary to allow
the PC board and HSDL-3021 pins
to change dimensions evenly,
putting minimal stresses on the
HSDL-3021.
It is recommended to perform
reflow soldering no more than
twice.
Recommended Reflow Profile
0
t-TIME (SECONDS)
P2
SOLDER PASTE DRY
T
°
C
230
217
200
180
150
120
80
50
150
100
200
250
300
255
P1
HEAT
UP
P3
SOLDER
REFLOW
P4
COOL
DOWN
25
R1
R2
R4
R5
60 sec.to 90 sec.
ABOVE
217
°
C
MAX. 260
°
C
R3
相關(guān)PDF資料
PDF描述
HSDL-3021-021 IrDA㈢ Data Compliant Low Power 4.0 Mbit/s with Remote Control Infrared Transceiver
HSDL-3203 Small Profile Package IrDA㈢ Data Compliant Low Power 115.2 kbit/s Infrared Transceiver
HSDL-3210 IrDA㈢ Compliant Low Power 1.15 Mbit/s Infrared Transceiver
HSDL-3210-021 IrDA㈢ Compliant Low Power 1.15 Mbit/s Infrared Transceiver
HSDL-3211 IrDA㈢ Data Compliant Low Power 1.15 Mbit/s Infrared Transceiver
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HSDL-3021-021 功能描述:紅外收發(fā)器 FIR + RC RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強(qiáng)度:60 mW/sr 半強(qiáng)度角度:44 deg 脈沖寬度:2 us 最大上升時(shí)間:100 ns 最大下降時(shí)間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel
HSDL-3200 制造商:未知廠家 制造商全稱:未知廠家 功能描述:IrDA 1.2 Data Compliant 115.2Kb/s 3V Infrared Transceiver
HSDL-3200#021 功能描述:紅外收發(fā)器 IR Transceiver 115.2Kb/s RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強(qiáng)度:60 mW/sr 半強(qiáng)度角度:44 deg 脈沖寬度:2 us 最大上升時(shí)間:100 ns 最大下降時(shí)間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel
HSDL-3200-921 制造商:Lite-On Semiconductor Corporation 功能描述:IRDA TX/RX 0.1152MBPS 2.7V TO 3.6V 8PIN - Tape and Reel
HSDL-3201 制造商:LITEON 制造商全稱:Lite-On Technology Corporation 功能描述:IrDA? Data 1.4 Low Power Compliant 115.2 kb/s Infrared Transceiver
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