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參數(shù)資料
| 型號： | HIP1012 |
| 廠商： | Intersil Corporation |
| 元件分類： | 基準電壓源/電流源 |
| 英文描述： | Dual Power Distribution Controller(雙電源分配控制器) |
| 中文描述： | 雙電源分配控制器（雙電源分配控制器） |
| 文件頁數(shù)： | 15/15頁 |
| 文件大?。?/td> | 544K |
| 代理商： | HIP1012 |
15
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
HIP1012A
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
0.25(0.010)
B
M
M
α
M14.15
(JEDEC MS-012-AB ISSUE C)
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3367
0.3444
8.55
8.75
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
α
14
14
7
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| HIP1012A | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Dual Power Distribution Controller |
| HIP1012A_04 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Dual Power Distribution Controller |
| HIP1012ACB | 功能描述:IC CTRLRL HOT PLUG DUAL 14-SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產(chǎn)品培訓模塊:Obsolescence Mitigation Program 標準包裝:100 系列:- 類型:熱插拔開關 應用:通用 內(nèi)部開關:是 電流限制:可調(diào) 電源電壓:9 V ~ 13.2 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應商設備封裝:10-TDFN-EP（3x3） 包裝:管件 |
| HIP1012ACB-T | 功能描述:IC CTRLRL HOT PLUG DUAL 14-SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產(chǎn)品培訓模塊:Obsolescence Mitigation Program 標準包裝:100 系列:- 類型:熱插拔開關 應用:通用 內(nèi)部開關:是 電流限制:可調(diào) 電源電壓:9 V ~ 13.2 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應商設備封裝:10-TDFN-EP（3x3） 包裝:管件 |
| HIP1012ACBTS2490 | 制造商:INTERSIL 功能描述:New |
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