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參數(shù)資料
| 型號： | HFA3860B |
| 廠商： | Intersil Corporation |
| 元件分類： | 基帶處理器 |
| 英文描述： | Direct Sequence Spread Spectrum Baseband Processor(直接序列擴頻基帶處理器) |
| 中文描述： | 直接序列擴頻基帶處理器（直接序列擴頻基帶處理器） |
| 文件頁數(shù)： | 36/40頁 |
| 文件大小： | 330K |
| 代理商： | HFA3860B |
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2-36
Absolute Maximum Ratings
Thermal Information
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0V
Input, Output or I/O Voltage. . . . . . . . . . . .GND -0.5V to V
CC
+0.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Class 2
Operating Conditions
Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . .+2.70V to +3.60V
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . -40
o
C to 85
o
C
Thermal Resistance (Typical, Note 7)
TQFP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Storage Temperature Range. . . . . . . . . . -65
o
C to 150
o
C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300
o
C
(Lead Tips Only)
θ
JA
(
ο
C/W)
80
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56,000 Gates
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
7.
θ
JA
is measured with the component mounted on an evaluation PC board in free air.
DC Electrical Specifications
V
CC
= 3.0V to 3.3V
±
10%, T
A
= -40
o
C to 85
o
C
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Power Supply Current
I
CCOP
V
CC
= 3.6V, CLK Frequency 44MHz
(Notes 8, 9)
-
30
40
mA
Standby Power Supply Current
I
CCSB
V
CC
= Max, Outputs Not Loaded
-
0.5
1
mA
Input Leakage Current
I
I
V
CC
= Max, Input = 0V or V
CC
-10
1
10
μ
A
Output Leakage Current
I
O
V
CC
= Max, Input = 0V or V
CC
-10
1
10
μ
A
Logical One Input Voltage
V
IH
V
CC
= Max, Min
0.7 V
CC
-
-
V
Logical Zero Input Voltage
V
IL
V
CC
= Min, Max
-
-
V
CC
/3
V
Logical One Output Voltage
V
OH
I
OH
= -1mA, V
CC
= Min
V
CC
-0.2
-
-
V
Logical Zero Output Voltage
V
OL
I
OL
= 2mA, V
CC
= Min
-
0.08
0.2
V
Input Capacitance
C
IN
CLK Frequency 1MHz. All measurements
referenced to GND. T
A
= 25
o
C, Note 9
-
5
10
pF
Output Capacitance
C
OUT
-
5
10
pF
NOTES:
8. Output load 30pF.
9. Not tested, but characterized at initial design and at major process/design changes.
Electrical Specifications
V
CC
= 3.0V to 3.3V
±
10%, T
A
= -40
o
C to 85
o
C (Note 10)
PARAMETER
SYMBOL
MCLK = 44MHz
UNITS
MIN
MAX
MCLK Period
t
CP
22.5
-
ns
MCLK Duty Cycle
43/57
57/43
%
Rise/Fall (All Outputs)
-
10
ns (Notes 11, 12)
TX_PE to IOUT/QOUT (1st Valid Chip)
t
D1
t
TLP
t
TCD
t
RC
t
TDS
t
TDH
t
PEH
t
PEH
t
PEH
t
PEH
t
RI
2.18
2.3
μ
s (Notes 11, 13)
μ
s (Notes 11, 14)
TX_PE Inactive Width
2.22
-
TX_CLK Width Hi or Low
40
-
ns
TX_RDY Active to 1st TX_CLK Hi
260
-
ns
Setup TXD to TX_CLK Hi
30
-
ns
Hold TXD to TX_CLK Hi
0
-
ns
TX_CLK to TX_PE Inactive (1Mbps)
0
965
ns (Notes 11, 24)
TX_CLK to TX_PE Inactive (2Mbps)
0
420
ns (Notes 11, 24)
TX_CLK to TX_PE Inactive (5.5Mbps)
0
160
ns (Notes 11, 24)
TX_CLK to TX_PE Inactive (11Mbps)
0
65
ns (Notes 11, 24)
TX_RDY Inactive To Last Chip of MPDU Out
-20
20
ns
HFA3860B
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|---|---|
| HFA3860BIV | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HFA3860BIV WAF | 制造商:Harris Corporation 功能描述: |
| HFA3860BIV96 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HFA3860IV | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Harris Corporation 功能描述: |
| HFA3860IV WAF | 制造商:Harris Corporation 功能描述: |
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