參數(shù)資料
型號: HCPL-316J
英文描述: 2.0 Amp Gate Drive Optocoupler with Integrated (V CE ) Desaturation Detection and Fault Status Feedback(帶集成不飽和檢測和誤差反饋的2.0 Amp門驅(qū)動耦合器)
中文描述: 2.0安培門極驅(qū)動光電耦合器與集成(五長官)飽和檢測與故障狀態(tài)反饋(帶集成不飽和檢測和誤差反饋的2.0安培門驅(qū)動耦合器)
文件頁數(shù): 30/32頁
文件大?。?/td> 503K
代理商: HCPL-316J
30
Figure 78. HCPL-316J Thermal Model.
T
ji
= junction temperature of input side IC
T
jo
= junction temperature of output side IC
T
P4
= pin 4 temperature at package edge
T
P9,10
= pin 9 and 10 temperature at package edge
θ
I4
= input side IC to pin 4 thermal resistance
θ
I9,10
= output side IC to pin 9 and 10 thermal resistance
θ
4A
= pin 4 to ambient thermal resistance
θ
9,10A
= pin 9 and 10 to ambient thermal resistance
*The
θ
4A
and
θ
9,10A
values shown here are for PCB layouts shown in Figure 78 with
reasonable air flow. This value may increase or decrease by a factor of 2 depending
on PCB layout and/or airflow.
T
P4
T
P9,10
θ
4A
= 50°C/W*
θ
9,10A
= 50°C/W*
T
A
θ
i4
= 60°C/W
θ
O9,10
= 30°C/W
T
ji
T
jo
Thermal Model
The HCPL-316J is designed to
dissipate the majority of the heat
through pins 4 for the input IC
and pins 9 and 10 for the output
IC. (There are two V
EE
pins on
the output side, pins 9 and 10,
for this purpose.) Heat flow
through other pins or through the
package directly into ambient are
considered negligible and not
modeled here.
In order to achieve the power
dissipation specified in the
absolute maximum specification,
it is imperative that pins 4, 9, and
10 have ground planes connected
to them. As long as the maximum
power specification is not
exceeded, the only other limita-
tion to the amount of power one
can dissipate is the absolute
maximum junction temperature
specification of 125
°
C. The
junction temperatures can be
calculated with the following
equations:
T
ji
= P
i
(
θ
i4
+
θ
4A
) + T
A
T
jo
= P
o
(
θ
o9,10
+
θ
9,10A
) + T
A
where P
i
= power into input IC
and P
o
= power into output IC.
Since
θ
4A
and
θ
9,10A
are
dependent on PCB layout and
airflow, their exact number may
not be available. Therefore, a
more accurate method of calcu-
lating the junction temperature is
with the following equations:
T
ji
= P
i
θ
i4
+ T
P4
T
jo
= P
o
θ
o9,10
+ T
P9,10
These equations, however,
require that the pin 4 and pins
9,10 temperatures be measured
with a thermal couple on the pin
at the HCPL-316J package edge.
From the earlier power
dissipation calculation
example:
P
i
= 90.8 mW, P
o
= 314 mW, T
A
= 100
°
C, and assuming the
thermal model shown in Figure
77 below.
T
ji
= (90.8 mW)(60
°
C/W
+ 50
°
C/W) + 100
°
C = 110
°
C
T
jo
= (240 mW)(30
°
C/W
+ 50
°
C/W) + 100
°
C = 119
°
C
both of which are within the
absolute maximum specification
of 125
°
C.
If we, however, assume a worst
case PCB layout and no air flow
where the estimated
θ
4A
and
θ
9,10A
are 100
°
C/W. Then the
junction temperatures become
T
ji
= (90.8 mW)(60
°
C/W
+ 100
°
C/W) + 100
°
C = 115
°
C
T
jo
= (240 mW)(30
°
C/W
+ 100
°
C/W) + 100
°
C = 131
°
C
The output IC junction
temperature exceeds the absolute
maximum specification of 125
°
C.
In this case, PCB layout and
airflow will need to be designed
so that the junction temperature
of the output IC does not exceed
125
°
C.
If the calculated junction
temperatures for the thermal
model in Figure 78 is higher than
125
°
C, the pin temperature for
pins 9 and 10 should be
measured (at the package edge)
under worst case operating
environment for a more accurate
estimate of the junction
temperatures.
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