
HI-SINCERITY
MICROELECTRONICS CORP.
HBAV70
SWITCHING DIODE
Spec. No. : HE6801
Issued Date : 1995.11.17
Revised Date : 2002.10.24
Page No. : 1/3
HBAV70
HSMC Product Specification
Description
The HBAV70 consists of two diodes in a plastic surface mount
package. The diodes are connected in series and the unit is
designed for high-speed switching application in hybrid thick and
thin-film circuits.
Features
Small SMD Package (SOT-23)
Ultra-high Speed
Low Forward Voltage
Fast Reverse Recovery Time
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature............................................................................................ -65 ~ +150
°
C
Junction Temperature.................................................................................................... +150
°
C
Maximum Power Dissipation
Total Power Dissipation (Ta=25
°
C)................................................................................ 250 mW
Maximum Voltages and Currents (Ta=25
°
C)
Reverse Voltage.................................................................................................................. 70 V
Forward Current ............................................................................................................. 200 mA
Repetitive Forward Current ............................................................................................ 500 mA
Characteristics
(Ta=25
°
C)
Characteristic
Symbol
V(BR)
VF(1)
VF(2)
VF(3)
VF(4)
IR
CT
Condition
Min
70
-
-
-
-
-
-
Max
-
715
855
1100
1300
5
1.5
Unit
V
mV
mV
mV
mV
uA
pF
Reverse Breakdown Voltage
IR=100uA
IF=1mA
IF=10mA
IF=50mA
IF=100mA
VR=70
VR=0, f=1MHz
IF=IR=10mA, RL=100
measured at IR=1mA, VR=5V
Forward Voltage
Reverse Current
Total Capacitance
Reverse Recovery Time
Trr
-
15
nS
SOT-23