HB52RF649DC-B, HB52RD649DC-B
Data Sheet E0223H30 (Ver. 3.0)
5
Byte No. Function described
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value
Comments
26
SDRAM access from Clock (3rd
highest /CE latency)
Undefined
Minimum row precharge time
Row active to row active min
(-75)
(-A6)
0
0
0
0
0
0
0
0
00
27
0
0
0
1
0
1
0
0
14
20ns
28
0
0
0
0
1
1
1
1
0F
15ns
0
0
0
1
0
1
0
0
14
20ns
29
/RE to /CE delay min
Minimum /RE pulse width
(-75)
(-A6)
0
0
0
1
0
1
0
0
14
20ns
30
0
0
1
0
1
1
0
1
2D
45ns
0
0
1
1
0
0
1
0
32
50ns
31
Density of each bank on module
Address and command signal input
setup time
(-75)
(-A6)
Address and command signal input
hold time
(-75)
(-A6)
Data signal input setup time
(-75)
(-A6)
Data signal input hold time
(-75)
(-A6)
0
1
0
0
0
0
0
0
40
256M byte
32
0
0
0
1
0
1
0
1
15
1.5ns
0
0
1
0
0
0
0
0
20
2.0ns
33
0
0
0
0
1
0
0
0
08
0.8ns
0
0
0
1
0
0
0
0
10
1.0ns
34
0
0
0
1
0
1
0
1
15
1.5ns
0
0
1
0
0
0
0
0
20
2.0ns
35
0
0
0
0
1
0
0
0
08
0.8ns
0
0
0
1
0
0
0
0
10
1.0ns
36 to 61
Superset information
0
0
0
0
0
0
0
0
00
Future use
62
SPD data revision code
Checksum for bytes 0 to 62
(-75)
(-A6)
0
0
0
1
0
0
1
0
12
Rev. 1.2B
63
0
1
0
1
1
1
0
1
5D
93
1
1
0
0
0
1
0
0
C4
196
64
Manufacturer’s JEDEC ID code
0
0
0
0
0
1
1
1
07
HITACHI
65 to 71
Manufacturer’s JEDEC ID code
0
0
0
0
0
0
0
0
00
72
Manufacturing location
×
×
×
×
×
×
×
×
××
*
2
(ASCII-8bit code)
73
Manufacturer’s part number
0
1
0
0
1
0
0
0
48
H
74
Manufacturer’s part number
0
1
0
0
0
0
1
0
42
B
75
Manufacturer’s part number
0
0
1
1
0
1
0
1
35
5
76
Manufacturer’s part number
0
0
1
1
0
0
1
0
32
2
77
Manufacturer’s part number
Manufacturer’s part number
(-75)
(-A6)
0
1
0
1
0
0
1
0
52
R
78
0
1
0
0
0
1
1
0
46
F
0
1
0
0
0
1
0
0
44
D
79
Manufacturer’s part number
0
0
1
1
0
1
1
0
36
6
80
Manufacturer’s part number
0
0
1
1
0
1
0
0
34
4
81
Manufacturer’s part number
0
0
1
1
1
0
0
1
39
9
82
Manufacturer’s part number
0
1
0
0
0
1
0
0
44
D
83
Manufacturer’s part number
0
1
0
0
0
0
1
1
43
C
84
Manufacturer’s part number
0
0
1
0
1
1
0
1
2D