參數(shù)資料
型號(hào): GE28F128W30B90
英文描述: CHIP RESISTOR
中文描述: 的EEPROM | FLASH動(dòng)畫(huà)| 8M × 16位|的CMOS | BGA封裝| 60PIN |塑料
文件頁(yè)數(shù): 4/91頁(yè)
文件大?。?/td> 994K
代理商: GE28F128W30B90
28F320W30, 28F640W30, 28F128W30
4
Datasheet
7.1.3
7.1.4
7.1.5
7.1.6
7.1.7
Protection Register ..............................................................................................................39
7.2.1
Reading the Protection Register.............................................................................40
7.2.2
Programing the Protection Register........................................................................40
7.2.3
Locking the Protection Register..............................................................................41
VPP Protection ....................................................................................................................42
Set Configuration Register
................................................................................................43
8.1
Read Mode (CR[15])............................................................................................................45
8.2
First Access Latency Count (CR[13:11]) .............................................................................45
8.3
WAIT Signal Polarity (CR[10]).............................................................................................47
8.4
WAIT Signal Function..........................................................................................................47
8.5
Data Hold (CR[9])................................................................................................................48
8.6
WAIT Delay (CR[8]).............................................................................................................49
8.7
Burst Sequence (CR[7]).......................................................................................................49
8.8
Clock Edge (CR[6])..............................................................................................................51
8.9
Burst Wrap (CR[3]) ..............................................................................................................51
8.10 Burst Length (CR[2:0]).........................................................................................................52
Power Consumption
.............................................................................................................52
9.1
Active Power........................................................................................................................52
9.2
Automatic Power Savings (APS) .........................................................................................52
9.3
Standby Power ....................................................................................................................53
9.4
Power-Up/Down Characteristics..........................................................................................53
9.4.1
System Reset and RST# ........................................................................................53
9.4.2
VCC, VPP, and RST# Transitions ..........................................................................53
9.5
Power Supply Decoupling....................................................................................................54
10.0 Thermal and DC Characteristics
.....................................................................................54
10.1 Absolute Maximum Ratings.................................................................................................54
10.2 Operating Conditions...........................................................................................................55
10.3 DC Current Characteristics..................................................................................................56
10.4 DC Voltage Characteristics..................................................................................................58
11.0 AC Characteristics
................................................................................................................59
11.1 Read Operations .................................................................................................................59
11.2 AC Write Characteristics......................................................................................................69
11.3 Erase and Program Times...................................................................................................73
11.4 Reset Specifications ............................................................................................................74
11.5 AC I/O Test Conditions........................................................................................................75
11.6 Device Capacitance.............................................................................................................76
Appendix A
Write State Machine States
.............................................................................77
Appendix B
Common Flash Interface
.................................................................................80
Lock-Down..............................................................................................................37
Block Lock Status ...................................................................................................38
Lock During Erase Suspend...................................................................................38
Status Register Error Checking ..............................................................................38
WP# Lock-Down Control ........................................................................................39
7.2
7.3
8.0
9.0
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