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參數資料
| 型號： | FXA1012WC |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 圖像傳感器 |
| 英文描述： | Frame Transfer CCD Image Sensor |
| 中文描述： | IMAGE SENSOR-CCD, SQUARE |
| 封裝： | LCC-24 |
| 文件頁數： | 13/17頁 |
| 文件大?。?/td> | 476K |
| 代理商： | FXA1012WC |
2000 January
13
Philips Semiconductors
Objective specification
Frame Transfer CCD Image Sensor
FXA 1012
Peripheral ICs
To allow compact and low-cost applications, use of the following
peripheral circuits for the FXA 1012 is suggested:
Pulse Pattern Generator
The PPG (pulse pattern generator) delivers all the pulses, at logic
level, to drive the vertical clocks of the CCD. For this sensor, the
PPG is included in the DSP SAA8122 or separately in the Timing
Generator SAA8103.
Vertical Drivers + DC/DC Converter
The vertical drivers convert the 3.3V or 5V logic pulses from the
PPG to 12V analog pulses to drive the vertical clocks of the CCD.
The recommended driver is the Philips TDA9991.
CDS - AGC - ADC
The combined CDS (correlated double sampling) - AGC (automatic
gain control) and ADC (10 bit analog-to-digital convertor) is the
easiest way to link the output of the CCD to a DSP (digital signal
processor). Philips Semiconductors # TDA8783
DSP
A dedicated DSP has been developed that can handle the image
format and different modes of the FXA 1012. Philips
Semiconductors # SAA8122.
Special modes of operation
Monitor mode with 240 lines vertical resolution is achieved with 1:5
subsampling, yielding 1200/5 = 240 lines. When 1:4 subsamlping is
applied, an image with 288 lines vertical resolution is obtained.
Device Handling
An image sensor is a MOS device which can be destroyed by electro-
static discharge (ESD). Therefore, the device should be handled
with care.
Always store the device with short-circuiting clamps or on conductive
foam. Always switch off all electric signals when inserting or removing
the sensor into or from a camera (the ESD protection in a CCD
image sensor is less effective than the ESD protection of standard
CMOS circuits).
Being a high quality optical device, it is important that the cover
glass remain undamaged. When handling the sensor, use fingercots.
To remove the protective tape from the cover glass, use the following
procedure:
do not scratch or tear off the protective tape before mounting.
peel off the tape slowly.
the use of an ionised air blower is recommended when peeling off
the tape.
once peeled off, do not reuse the tape.
To clean stains from the package surface, use a cotton stick soaked
in ethanol. Wipe carefully in order not to scratch the glass surface.
Dry rubbing of the cover glass may cause electro-static discharges
which can destroy the device.
Soldering information
The CCD package temperature must not exceed 150°C. Soldering
iron temperature should be under 300°C when mounting a CCD on
a printed circuit board. Aim for a soldering time of 3 seconds per
pad. Use a soldering iron that has an adjustable temperature control
function (that is grounded) that holds the soldering iron tip at a
constant temperature.
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