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          • 您現(xiàn)在的位置:買賣IC網(wǎng) > PDF目錄375775 > FDP3652 (FAIRCHILD SEMICONDUCTOR CORP) CAP CER .39UF 50V 10% X7R 1206 PDF資料下載
          參數(shù)資料
          型號: FDP3652
          廠商: FAIRCHILD SEMICONDUCTOR CORP
          元件分類: JFETs
          英文描述: CAP CER .39UF 50V 10% X7R 1206
          中文描述: 9 A, 100 V, 0.016 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB
          封裝: TO-220AB, 3 PIN
          文件頁數(shù): 7/11頁
          文件大?。?/td> 272K
          代理商: FDP3652
          第1頁第2頁第3頁第4頁第5頁第6頁當前第7頁第8頁第9頁第10頁第11頁
          2002 Fairchild Semiconductor Corporation
          FDB3652 / FDP3652 / FDI3652 Rev. B
          F
          Thermal Resistance vs. Mounting Pad Area
          The maximum rated junction temperature, T
          JM
          , and the
          thermal resistance of the heat dissipating path determines
          the maximum allowable device power dissipation, P
          DM
          , in an
          application.
          Therefore
          temperature, T
          A
          (
          o
          C), and thermal resistance R
          θ
          JA
          (
          o
          C/W)
          must be reviewed to ensure that T
          JM
          is never exceeded.
          Equation 1 mathematically represents the relationship and
          serves as the basis for establishing the rating of the part.
          the
          application’s
          ambient
          In using surface mount devices such as the TO-263
          package, the environment in which it is applied will have a
          significant influence on the part’s current and maximum
          power dissipation ratings. Precise determination of P
          DM
          is
          complex and influenced by many factors:
          1. Mounting pad area onto which the device is attached and
          whether there is copper on one side or both sides of the
          board.
          2. The number of copper layers and the thickness of the
          board.
          3. The use of external heat sinks.
          4. The use of thermal vias.
          5. Air flow and board orientation.
          6. For non steady state applications, the pulse width, the
          duty cycle and the transient thermal response of the part,
          the board and the environment they are in.
          Fairchild provides thermal information to assist the
          designer’s preliminary application evaluation. Figure 21
          defines the R
          θ
          JA
          for the device as a function of the top
          copper (component side) area. This is for a horizontally
          positioned FR-4 board with 1oz copper after 1000 seconds
          of steady state power with no air flow. This graph provides
          the necessary information for calculation of the steady state
          junction
          temperature
          or
          applications can be evaluated using the Fairchild device
          Spice thermal model or manually utilizing the normalized
          maximum transient thermal impedance curve.
          power
          dissipation.
          Pulse
          Thermal resistances corresponding to other copper areas
          can be obtained from Figure 21 or by calculation using
          Equation 2 or 3. Equation 2 is used for copper area defined
          in inches square and equation 3 is for area in centimeter
          square. The area, in square inches or square centimeters is
          the top copper area including the gate and source pads.
          (EQ. 1)
          PDM
          θ
          JA
          –
          (
          -----------------------------
          )
          =
          Area in Iches Squared
          (EQ. 2)
          R
          θ
          JA
          26.51
          +
          0.262
          Area
          (
          )
          -----------19.84
          +
          =
          (EQ. 3)
          R
          θ
          JA
          26.51
          +
          1.69
          Area
          (
          )
          -----------128
          +
          =
          Area in Centimeter Squared
          Figure 21. Thermal Resistance vs Mounting
          Pad Area
          20
          40
          60
          80
          1
          10
          0.1
          R
          θ
          JA
          = 26.51+ 19.84/(0.262+Area) EQ.2
          R
          θ
          J
          (
          o
          C
          AREA, TOP COPPER AREA in
          2
          (cm
          2
          )
          (0.645)
          (6.45)
          (64.5)
          R
          θ
          JA
          = 26.51+ 128/(1.69+Area) EQ.3
          相關(guān)PDF資料
          PDF描述
          FDB3652 N-Channel PowerTrench MOSFET 100V, 61A, 16mз
          FDI8442 N-Channel PowerTrench㈢ MOSFET
          FDJ1027P P-Channel 1.8V Specified PowerTrench MOSFET
          FDJ1028N Plug-In Relay; Contacts:DPDT; Contact Carry Current:12A; Coil Voltage AC Max:12V; Relay Mounting:Plug-In; Relay Terminals:8-Pin Octal; Relay Options:Hermetically Sealed; Coil Resistance:72ohm; Contact Carrying Power:1.2W RoHS Compliant: Yes
          FDJ1032C Plug-In Relay; Contacts:DPDT; Contact Carry Current:12A; Coil Voltage AC Max:120V; Relay Mounting:Plug-In; Relay Terminals:8-Pin Octal; Relay Options:Hermetically Sealed; Coil Resistance:9100ohm; Contact Carrying Power:1.2W RoHS Compliant: Yes
          相關(guān)代理商/技術(shù)參數(shù)
          參數(shù)描述
          FDP3652 制造商:Fairchild Semiconductor Corporation 功能描述:MOSFET N TO-220
          FDP3652_NL 制造商:Fairchild 功能描述:100V/61A N-CH MOSFET
          FDP3652_Q 功能描述:MOSFET 100V 61a 0.016 Ohm RoHS:否 制造商:STMicroelectronics 晶體管極性:N-Channel 汲極/源極擊穿電壓:650 V 閘/源擊穿電壓:25 V 漏極連續(xù)電流:130 A 電阻汲極/源極 RDS(導(dǎo)通):0.014 Ohms 配置:Single 最大工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:Max247 封裝:Tube
          FDP3672 功能描述:MOSFET 105V 41a 0.033 Ohms/VGS=10V RoHS:否 制造商:STMicroelectronics 晶體管極性:N-Channel 汲極/源極擊穿電壓:650 V 閘/源擊穿電壓:25 V 漏極連續(xù)電流:130 A 電阻汲極/源極 RDS(導(dǎo)通):0.014 Ohms 配置:Single 最大工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:Max247 封裝:Tube
          FDP3672_NL 制造商:Fairchild 功能描述:105V/41A N-CH MOSFET
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