參數(shù)資料
型號(hào): FDC6318
廠商: Fairchild Semiconductor Corporation
英文描述: Dual P-Channel 1.8V PowerTrench Specified MOSFET
中文描述: 雙P溝道MOSFET的1.8伏的PowerTrench指定
文件頁數(shù): 2/5頁
文件大?。?/td> 165K
代理商: FDC6318
FDC6318P Rev D (W)
Electrical Characteristics
T
A
= 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ Max Units
Off Characteristics
BV
DSS
Drain–Source Breakdown Voltage
BV
DSS
T
J
Coefficient
I
DSS
Zero Gate Voltage Drain Current
I
GSSF
Gate–Body Leakage, Forward
I
GSSR
Gate–Body Leakage, Reverse
V
GS
= 0 V,
I
D
= –250
μ
A, Referenced to 25
°
C
V
DS
= –10 V,
V
GS
= 0 V
V
GS
= 8 V,
V
DS
= 0 V
V
GS
= –8 V,
V
DS
= 0 V
I
D
= –250
μ
A
–12
V
Breakdown Voltage Temperature
–2.9
mV/
°
C
μ
A
nA
nA
–1
100
–100
On Characteristics
V
GS(th)
Gate Threshold Voltage
V
GS(th)
T
J
Temperature Coefficient
R
DS(on)
Static Drain–Source
On–Resistance
(Note 2)
V
DS
= V
GS
,
I
D
= –250
μ
A, Referenced to 25
°
C
V
GS
= –4.5 V, I
D
= –2.5 A
V
GS
= –2.5 V, I
D
= –2 A
V
GS
= –1.8 V, I
D
= –1.6 A
V
GS
= –4.5 V, I
D
= –2.5A, T
J
=125
°
C
V
GS
= –4.5 V, V
DS
= –5 V
V
DS
= –5 V,
I
D
= –2.5 A
I
D
= –250
μ
A
–0.4
–0.7
2.3
69
93
135
85
–1.5
V
Gate Threshold Voltage
mV/
°
C
m
90
125
200
120
I
D(on)
g
FS
On–State Drain Current
Forward Transconductance
–6
A
S
8
Dynamic Characteristics
C
iss
Input Capacitance
C
oss
Output Capacitance
C
rss
Reverse Transfer Capacitance
455
194
134
pF
pF
pF
V
DS
= –6 V,
f = 1.0 MHz
V
GS
= 0 V,
Switching Characteristics
(Note 2)
t
d(on)
Turn–On Delay Time
t
r
Turn–On Rise Time
t
d(off)
Turn–Off Delay Time
t
f
Turn–Off Fall Time
Q
g
Total Gate Charge
Q
gs
Gate–Source Charge
Q
gd
Gate–Drain Charge
9
14
21
17
5.4
1.1
1.3
18
25
34
31
8
ns
ns
ns
ns
nC
nC
nC
V
DD
= –6 V,
V
GS
= –4.5 V, R
GEN
= 6
I
D
= –1 A,
V
DS
= –6 V,
V
GS
= –4.5 V
I
D
= –2.5 A,
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain–Source Diode Forward Current
Drain–Source Diode Forward
Voltage
–0.8
A
V
SD
V
GS
= 0 V,
I
S
= –0.8 A
(Note 2)
–0.7
–1.2
V
Notes:
1.
R
θ
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θ
JC
is guaranteed by design while R
θ
CA
is determined by the user's board design.
a) 130
°
C/W when
mounted on a 0.125
in
pad of 2 oz.
copper.
b) 140°C/W when mounted
on a .004 in
pad of 2 oz
copper
c) 180°C/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2.
Pulse Test: Pulse Width < 300
μ
s, Duty Cycle < 2.0%
F
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