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參數(shù)資料
| 型號： | FC1703 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | Receiver RFIC for Dual-Band Triple Mode |
| 中文描述： | 射頻接收器的雙頻三模式 |
| 文件頁數(shù)： | 17/17頁 |
| 文件大?。?/td> | 508K |
| 代理商： | FC1703 |
FC1703
Receiver RFIC for Dual-Band Triple Mode
R
EWORK
G
UIDELINES
Since solder joints are not fully exposed in the case
of MLFs, any retouch is limited to the side fillet. For
defects underneath the package, the whole package
has to be removed. Rework of MLF packages can be
a challenge due to their small size. In most
applications, MLFs will be mounted on smaller, thinner,
and denser PCBs that introduces further challenges
due to handling and heating issues. Since reflow of
adjacent parts is not desirable during rework, the
proximity of other components may further complicate
this process. Because of the product dependent
complexities, the following only provides a guideline
and a starting point for the development of a
successful rework process for these packages.
The rework process involves the following steps:
¨
Component Removal
¨
Site Redress
¨
Solder Paste Application,
¨
Component Placement, and
¨
Component Attachment.
These steps are discussed in the following in more
detail. Prior to any rework, it is strongly recommended
that the PCB assembly be baked for at least 4 hours
at 125
to remove any residual moisture from the
assembly.
4.1. Component Removal
The first step in removal of component is the reflow
of solder joints attaching component to the board.
Ideally the reflow profile for part removal should be the
same as the one used for part attachment. However,
the time above liquidus can be reduced as long as the
reflow is complete.
In the removal process, it is recommended that the
board should be heated from the bottom side using
convective heaters and hot gas or air should be used
on the top side of he component. Special nozzles
should be used to direct the heating in the component
area and heating of adjacent components should be
minimized. Excessive airflow should also be avoided
since this may cause CSP to skew. Air velocity of 15 –
20 liters per minute is a good starting point.
Once the joints have reflowed, the Vacuum lift-off
should be automatically engaged during the transition
from reflow to cooldown. Because of their small size
the vacuum pressure should be kept below 15” of Hg.
This will allow the component not to be lifted out if all
joints have not been reflowed and avoid the pad liftoff.
4.2. Site Redress
After the component has been removed, the site
Preliminary
17 / 17
Last Update 10/16/02
F
uture
C
ommunications
I
ntegrated circuit Inc.
needs to be cleaned properly. It is best to use a
combination of a blade-style conductive tool and
desoldering braid. The width of he blade should be
matched to the maximum width of the footprint and
the blade temperature should be low enough not to
cause any damage to the circuit board. Once the
residual solder has been removed, the lands should
be cleaned with a solvent. The solvent is usually
specific to the type of paste used in the original
assembly and paste manufacturer’s recommendations
should be followed.
4.3. Solder Paste Printing
Because of their small size and finer pitches, solder
paste deposition for MLFs requires extra care.
However, a uniform and precise deposition can be
achieved if miniature stencil specific to the component
is used. The stencil aperture should be aligned with
the pads under 50 to 100X magnification. The stencil
should then be lowered onto the PCB and the paste
should be deposited with a small metal squeegee
blade. The blade width should be the same as the
package width to ensure single pass paste deposition
thus avoiding any overprinting.
The stencil thickness and aperture size and shape
should be the same as used for the original assembly.
Also, no-clean flux should be used, as small standoff
of MLFs does not leave much room for cleaning.
4.4. Component Placement
MLF packages are expected to have superior self-
centering ability due to their small mass and the
placement of this package should be similar to that of
BGAs. As the leads are on the underside of the
package, split-beam optical system should be used to
align the component on the motherboard. This will
form an image of solder balls overlaid on the mating
footprint and aid in proper alignment. Again, the
alignment should be done at 50 to 100X magnification.
The placement machine should have the capability of
allowing fine adjustments in X, Y, and rotational axes.
4.5. Component Attachment
The reflow profile developed during original
attachment or removal should be used to attach the
new component. Since all reflow profile parameters
have already been optimized, using the same profile
will eliminate the need for thermocouple feedback and
will reduce operator dependencies.
(from Application Notes for Amkor’s MLF Package)
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