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參數(shù)資料
| 型號(hào)： | FC1703 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | Receiver RFIC for Dual-Band Triple Mode |
| 中文描述： | 射頻接收器的雙頻三模式 |
| 文件頁數(shù)： | 14/17頁 |
| 文件大小： | 508K |
| 代理商： | FC1703 |
FC1703
Receiver RFIC for Dual-Band Triple Mode
14 / 17
Last Update 03/28/03
F
uture
C
ommunications
I
ntegrated circuit Inc.
R
ECOMMENDED
B
OARD
L
AND
P
ATTERN
D
IMENSIONS
Z
G
A
D
W
X
Y
Size
4.36
2.98
2.78
2.68
0.22
0.28
0.69
All Dimensions in mm
-
The solder mask opening should be 120 to 150 microns larger than the pad size resulting in 60
to 75 micron clearance between the copper pad and solder mask.
-
Typically each pad on the PCB should have its own solder mask opening with a web of solder
mask between two adjacent pads.
-
It should be noted that the inner edge of the solder mask should be rounded, especially for
corner leads to allow for enough solder mask web in the corner area.
-
It is recommended that an array of thermal vias should be incorporated at 1.0 to 1.2mm pitch
with via diameter of 0.3 to 0.33mm.
-
The mask opening should be 100 microns smaller than the thermal land size on all four sides.
-
The solder mask diameter should be 100 microns larger than the via diameter.
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