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參數(shù)資料
| 型號： | FC1703 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | Receiver RFIC for Dual-Band Triple Mode |
| 中文描述： | 射頻接收器的雙頻三模式 |
| 文件頁數(shù)： | 16/17頁 |
| 文件大?。?/td> | 508K |
| 代理商： | FC1703 |
FC1703
Receiver RFIC for Dual-Band Triple Mode
16 / 17
Last Update 03/28/03
F
uture
C
ommunications
I
ntegrated circuit Inc.
R
ECOMMENDED
C
ONDITION
F
OR
R
EFLOW
S
OLDERING
Figure 1 shows the typical process flow for
mounting surface mount packages to printed
circuit boards. The same process can be used
for mounting the MLFs without any modifications.
It is important to include post print and post
reflow inspection, especially during process
development. The volume of paste printed
should be measured either by 2D or 3D
techniques. The paste volume should be around
80 to 90% of stencil aperture volume to indicate
good paste release. After reflow, the mounted
package should be inspected in transmission x-
ray for the presence of voids, solder balling, or
other defects. Cross-sectioning may also be
required to determine the fillet shape and size
and joint standoff height.
A typical reflow profile for No Clean solder
paste is shown in Figure 2. Since the actual
reflow profile depends on the solder paste being
used and the board density, a specific profile is
not recommended. However, the temperature
should not exceed 240
liquidus temperature should be less than 75
seconds. The maximum temperature can be
increased for Pb free solder if the package has
been qualified for higher temperature moisture
sensitivity level. The ramp rate during preheat
should be 3
/second or lower.
and the time above
Figure 1. Typical PCB Mounting Process Flow.
Figure 2. Typical Solder Reflow Profile
(from Application Notes for Amkor’s MLF Package)
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