參數(shù)資料
型號(hào)： EVAL-AD7730LEBZ
廠商： Analog Devices Inc
文件頁數(shù)： 45/53頁
文件大?。?/td> 0K
描述： BOARD EVALUATION FOR AD7730
標(biāo)準(zhǔn)包裝： 1
ADC 的數(shù)量： 1
位數(shù)： 24
采樣率（每秒）： 600
數(shù)據(jù)接口： 串行
輸入范圍： ±80 mV
在以下條件下的電源（標(biāo)準(zhǔn)）： 125mW @ 600SPS
工作溫度： -40°C ~ 85°C
已用 IC / 零件： AD7730
已供物品： 板，CD
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AD7730/AD7730L
–5–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7730 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS*
(TA = +25
°C unless otherwise noted)
AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . –5 V to +0.3 V
AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . . . –2 V to +5 V
Analog Input Voltage to AGND . . . . –0.3 V to AVDD + 0.3 V
Reference Input Voltage to AGND . . –0.3 V to AVDD + 0.3 V
AIN/REF IN Current (Indefinite) . . . . . . . . . . . . . . . . 30 mA
Digital Input Voltage to DGND . . . . –0.3 V to DVDD + 0.3 V
Digital Output Voltage to DGND . . . –0.3 V to DVDD + 0.3 V
Output Voltage (ACX,
ACX, D0, D1) to DGND
. . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Plastic DIP Package, Power Dissipation . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . 105°C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . +260
°C
TSSOP Package, Power Dissipation . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . 128°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . +220
°C
SOIC Package, Power Dissipation . . . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . +220
°C
*Stresses above those listed under Absolute Maximum Ratings may cause
permanent damage to the device. This is a stress rating only; functional
operation of the device at these or any other conditions above those listed in
the operational sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device
reliability.
TO OUTPUT
PIN
50pF
ISINK (800 A AT DVDD = +5V
100 A AT DVDD = +3V)
+1.6V
ISOURCE (200 A AT DVDD = +5V
100 A AT DVDD = +3V)
Figure 1. Load Circuit for Access Time and Bus Relinquish Time
WARNING!
ESD SENSITIVE DEVICE
REV. B
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