68 Datasheet 6.1 Thermal Management Accessories The following is a list of suggested s" />
參數(shù)資料
型號: ET80960JT10016
廠商: Intel
文件頁數(shù): 65/86頁
文件大?。?/td> 0K
描述: IC MPU I960JT 3V 100MHZ 132-QFP
標準包裝: 1
處理器類型: i960
特點: 后綴 JT,32 位 16K 高速緩沖
速度: 100MHz
電壓: 3V
安裝類型: 表面貼裝
封裝/外殼: 132-QFP
供應商設備封裝: 132-QFP
包裝: 托盤
其它名稱: 864017
80960JA/JF/JD/JS/JC/JT 3.3 V Embedded 32-Bit Microprocessor
68
Datasheet
6.1
Thermal Management Accessories
The following is a list of suggested sources for 80960Jx thermal solutions. This is neither an
endorsement or a warranty of the performance of any of the listed products and/or companies.
6.1.1
Heatsinks
1. Thermalloy, Inc.
2021 West Valley View Lane
Dallas, TX 75234-8993
(972) 243-4321
2. Wakefield Engineering
60 Audubon Road
Wakefield, MA 01880
(617) 245-5900
3. Aavid Thermal Technologies, Inc.
One Kool Path
Laconia, NH 03247-0400
(603) 528-3400
Table 41. Maximum TA at Various Airflows in °C (80960JA/JF)
Airflow-ft/min (m/sec)
fCLKIN (MHz)
0
(0)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
1000
(5.07)
PQFP
Package
For x80960JA/JF
TA without Heatsink
33
25
16
79
84
89
86
89
92
87
90
93
90
92
95
92
94
96
93
94
96
For x80960JA-25
TA without Heatsink
25
84
89
90
92
94
PGA
Package
TA without Heatsink
33
25
16
78
83
88
83
87
91
87
90
93
89
92
94
90
92
95
91
93
95
TA with Omnidirectional
Heatsink1
33
25
16
87
90
93
92
94
96
95
96
97
96
97
98
96
97
98
96
97
98
TA with Unidirectional
Heatsink2
33
25
16
86
89
92
93
94
96
95
96
97
96
97
98
96
97
98
96
97
98
MPBGA
Package TA without Heatsink
33
25
73
79
80
84
82
86
83
87
84
87
84
87
NOTES:
1. 0.248 inch high omnidirectional heatsink (AI alloy 6061, 41 mil fin width, 124 mil center-to-center fin
spacing).
2. 0.250 inch high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 146 mil center-to-center fin
spacing).
3. To address the fact that many of the package prefix variables have changed, all package prefix variables
in this document are now indicated with an "x".
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