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| 型號： | EPIC |
| 英文描述： | EPiC Family Product Line (304k) |
| 中文描述： | 史詩系列產(chǎn)品線（304k） |
| 文件頁數(shù)： | 2/12頁 |
| 文件大?。?/td> | 304K |
| 代理商： | EPIC |
10
www.semtech.com
HIGH PERFORMANCE PRODUCTS
Revision 1/December 3, 2001
AN1001
The junction temperature may be predicted by the equa-
tion:
T
J
= T
A
+
q
JA
* P
D
However, T
J
of any EPiC product will vary over a wide
range, depending on the environment. The power con-
sumption is a function of the total supply voltage (VCC
- VEE) and the particular output configuration (open
emitter, series termination) selected. Thermal resis-
tance
q
JA
, is heavily dependent upon the particular cool-
ing technique used.
Not all parts may be used reliable for all cooling
schemes or power supply conditions. The EPiC Prod-
uct Line is optimized to provide the most integration
and performance for environments using either liquid
(or cold plate) cooling, or air flow >300 LFPM. How-
ever, the 15XX, 19XX and 44XX families all have sev-
eral low power options which can be used with little or
no forced cooling.
The actual
q
JA
will be different for each particular envi-
ronment. However, estimates of typical
q
JA
performance
in several common cooling environments are provided.
Liquid Cooling
In the liquid cooling environment there is no airflow. All
cooling is achieved via conduction through the top of
the package into a cold plate as well as though the lead
frame down into the power planes inside of the printed
circuit board.
Thermal Analysis
DIE
TJ
19XX, 15XX, 44XX
Thermal
Compound
Air Gap
Pad
Power Plane
PC Board
Power Plane
COLD PLATE
TA
Heat Flow
vias
The following assumptions are made:
1)
the part is soldered to a multilayer PC board
with internal power planes
2)
the part is attached directly to the cold plate on
the top side of the package.
Orthogonal Air Flow
Orthogonal air flow is an environment where cold air
flows directly down to the top of the package. In this
case, cooling is achieved via convection as the cold air
absorbs the heat at the top of the package and carries
the heat out on the side, as well as via conduction
through the lead frame down into the power planes in-
side the printed circuit board. This cooling scheme pro-
duces the lowest thermal resistance for any air cooled
scheme.
The flowing assumptions are made:
1)
the part is soldered to a multilayer PC board
with internal power planes
2)
no heat sink.
In this environment,
q
JA
,
@ 30oC / watt.
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