參數(shù)資料
型號: EPF10K200S
英文描述: Programmable Logic
中文描述: 可編程邏輯
文件頁數(shù): 97/138頁
文件大?。?/td> 2116K
代理商: EPF10K200S
Altera Corporation
61
FLEX 10K Embedded Programmable Logic Family Data Sheet
Notes to tables:
(1)
Microparameters are timing delays contributed by individual architectural elements. These parameters cannot be
measured explicitly.
(2)
Operating conditions: VCCIO = 5.0 V ± 5% for commercial use in FLEX 10K devices.
VCCIO = 5.0 V ± 10% for industrial use in FLEX 10K devices.
VCCIO = 3.3 V ± 10% for commercial or industrial use in FLEX 10KA devices.
(3)
Operating conditions: VCCIO = 3.3 V ± 10% for commercial or industrial use in FLEX 10K devices.
VCCIO = 2.5 V ± 0.2 V for commercial or industrial use in FLEX 10KA devices.
(4)
Operating conditions: VCCIO = 2.5 V, 3.3 V, or 5.0 V.
(5)
Because the RAM in the EAB is self-timed, this parameter can be ignored when the WE signal is registered.
(6)
EAB macroparameters are internal parameters that can simplify predicting the behavior of an EAB at its boundary;
these parameters are calculated by summing selected microparameters.
(7)
These parameters are worst-case values for typical applications. Post-compilation timing simulation and timing
analysis are required to determine actual worst-case performance.
(8)
External reference timing parameters are factory-tested, worst-case values specified by Altera. A representative
subset of signal paths is tested to approximate typical device applications.
(9)
Contact Altera Applications for test circuit specifications and test conditions.
(10) These timing parameters are sample-tested only.
Table 39. External Bidirectional Timing Parameters
Symbol
Parameter
Condition
tINSUBIDIR
Setup time for bidirectional pins with global clock at adjacent LE register
tINHBIDIR
Hold time for bidirectional pins with global clock at adjacent LE register
tOUTCOBIDIR
Clock-to-output delay for bidirectional pins with global clock at IOE register
tXZBIDIR
Synchronous IOE output buffer disable delay
tZXBIDIR
Synchronous IOE output buffer enable delay, slow slew rate = off
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF10K200SBC356-1 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SBC356-1X 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SBC356-2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SBC356-2X 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SBC356-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256