參數(shù)資料
型號： EPF10K200S
英文描述： Programmable Logic
中文描述： 可編程邏輯
文件頁數(shù)： 2/138頁
文件大?。?/td> 2116K
代理商： EPF10K200S
10
Altera Corporation
FLEX 10K Embedded Programmable Logic Family Data Sheet
Logic functions are implemented by programming the EAB with a read-
only pattern during configuration, creating a large LUT. With LUTs,
combinatorial functions are implemented by looking up the results, rather
than by computing them. This implementation of combinatorial functions
can be faster than using algorithms implemented in general logic, a
performance advantage that is further enhanced by the fast access times
of EABs. The large capacity of EABs enables designers to implement
complex functions in one logic level without the routing delays associated
with linked LEs or field-programmable gate array (FPGA) RAM blocks.
For example, a single EAB can implement a 4
× 4 multiplier with eight
inputs and eight outputs. Parameterized functions such as LPM functions
can automatically take advantage of the EAB.
The EAB provides advantages over FPGAs, which implement on-board
RAM as arrays of small, distributed RAM blocks. These FPGA RAM
blocks contain delays that are less predictable as the size of the RAM
increases. In addition, FPGA RAM blocks are prone to routing problems
because small blocks of RAM must be connected together to make larger
blocks. In contrast, EABs can be used to implement large, dedicated
blocks of RAM that eliminate these timing and routing concerns.
EABs can be used to implement synchronous RAM, which is easier to use
than asynchronous RAM. A circuit using asynchronous RAM must
generate the RAM write enable (WE) signal, while ensuring that its data
and address signals meet setup and hold time specifications relative to the
WE
signal. In contrast, the EAB’s synchronous RAM generates its own WE
signal and is self-timed with respect to the global clock. A circuit using the
EAB’s self-timed RAM need only meet the setup and hold time
specifications of the global clock.
When used as RAM, each EAB can be configured in any of the following
sizes: 256
× 8, 512 × 4, 1,024 × 2, or 2,048 × 1. See Figure 2.
Figure 2. EAB Memory Congurations
256
× 8
512
× 4
1,024
× 2
2,048
× 1
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF10K200SBC356-1 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SBC356-1X 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SBC356-2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SBC356-2X 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SBC356-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
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