- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄97868 > DS232AS (DALLAS SEMICONDUCTOR) LINE TRANSCEIVER, PDSO16 PDF資料下載
參數(shù)資料
| 型號： | DS232AS |
| 廠商： | DALLAS SEMICONDUCTOR |
| 元件分類： | Line Driver or Receiver |
| 英文描述： | LINE TRANSCEIVER, PDSO16 |
| 封裝： | 0.300 INCH, SOIC-16 |
| 文件頁數(shù)： | 12/28頁 |
| 文件大?。?/td> | 581K |
| 代理商： | DS232AS |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁當(dāng)前第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VIN = 12V, RT = 33k, CVCC = 4.7F, CIN = 1F, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.)
(Note 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: These power limits are due to the thermal characteristics of the package, absolute maximum junction temperature (150°C),
and the JEDEC 51-7 defined setup. Maximum power dissipation could be lower, limited by the thermal shutdown protection
included in this IC.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to http://www.maximintegrated.com/thermal-tutorial.
IN to SGND.............................................................-0.3V to +30V
BST_ to VCC............................................................-0.3V to +30V
LX_ to SGND .............................................................-1V to +30V
EN_ to SGND............................................................-0.3V to +6V
PGOOD_ to SGND .................................................-0.3V to +30V
BST_ to LX_ ..............................................................-0.3V to +6V
DH_ to LX_ ..........................................….-0.3V to (VBST_ + 0.3V)
DL_ to PGND_ ............................................-0.3V to (VCC + 0.3V)
SGND to PGND_ .................................................. -0.3V to +0.3V
VCC to SGND................-0.3V to the lower of +6V or (VIN + 0.3V)
All Other Pins to SGND...............................-0.3V to (VCC + 0.3V)
VCC Short Circuit to SGND.........................................Continuous
VCC Input Current (IN = VCC, internal LDO not used) ......600mA
PGOOD_ Sink Current ........................................................20mA
Continuous Power Dissipation (TA = +70°C)(Note 1)
24-Pin TQFN-EP (derate 27.8mW/°C above +70°C)......2222.2mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
GENERAL
5.5
28
Input Voltage Range
VIN
VIN = VCC
4.5
5.5
V
Quiescent Supply Current
IIN
VFB1 = VFB2 = 0.9V, no switching
4.5
6
mA
Standby Supply Current
IIN_SBY
VEN1 = VEN2 = VSGND
0.21
0.35
mA
VCC REGULATOR
6V < VIN < 28V, ILOAD = 5mA
Output Voltage
VCC
VIN = 6V, 1mA < ILOAD < 100mA
5.00
5.2
5.50
V
VCC Regulator Dropout
ILOAD = 100mA
0.07
V
VCC Short-Circuit Output Current
VIN = 5V
150
250
mA
VCC Undervoltage Lockout
VCC_UVLO VCC falling
3.6
3.8
4
V
VCC Undervoltage Lockout
Hysteresis
430
mV
ERROR AMPLIFIER (FB_, COMP_)
FB_ Input Voltage Set-Point
VFB_
594
600
606
mV
FB_ Input Bias Current
IFB_
VFB_ = 0.6V
-250
+250
nA
PACKAGE THERMAL CHARACTERISTICS (Note 2)
24 TQFN-EP
Junction-to-Ambient Thermal Resistance (
θJA)...............+36°C/W
Junction-to-Case Thermal Resistance (
θJC)......................+8°C/W
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| DS232A | LINE TRANSCEIVER, PDIP16 |
| DS2404S-001 | 0 TIMER(S), REAL TIME CLOCK, PDSO16 |
| DS2404B | 0 TIMER(S), REAL TIME CLOCK, PDSO16 |
| DS2404 | 0 TIMER(S), REAL TIME CLOCK, PDIP16 |
| DS2405P | SPECIALTY MEMORY CIRCUIT, PDSO6 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DS232AS/T&R | 制造商:Maxim Integrated Products 功能描述:IC TXRX DUAL RS-232 5V 16-SOIC |
| DS232AS/T&R | 功能描述:RS-232接口集成電路 RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝: |
| DS232AS+ | 功能描述:RS-232接口集成電路 Dual RS-232 Transmitter/Receiver RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝: |
| DS232AS+T&R | 制造商:Maxim Integrated Products 功能描述:IC TXRX DUAL RS-232 5V 16-SOIC |
| DS232AS+T&R | 功能描述:RS-232接口集成電路 RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。