參數(shù)資料
型號: DS21352L
英文描述: 3.3V DS21352 and 5V DS21552 T1 Single-Chip Transceivers
中文描述: 3.3 DS21352及5V DS21552 T1單芯片收發(fā)器
文件頁數(shù): 5/137頁
文件大小: 1094K
代理商: DS21352L
DS21352/DS21552
5 of 137
1. LIST OF FIGURES
Figure 3-1 SCT BLOCK DIAGRAM.........................................................................................................9
Figure 16-1 EXTERNAL ANALOG CONNECTIONS ..........................................................................87
Figure 16-2 OPTIONAL CRYSTAL CONNECTIONS..........................................................................88
Figure 16-3 TRANSMIT WAVEFORM TEMPLANE............................................................................89
Figure 16-4 JITTER TOLERANCE.........................................................................................................91
Figure 16-5 JITTER ATTENUATION....................................................................................................91
Figure 16-6 PROTECTED INTERFACE EXAMPLE FOR THE DS21552...........................................93
Figure 16-7 PROTECTED INTERFACE EXAMPLE FOR TE DS21352..............................................94
Figure 16-8 TYPICAL MONITOR PORT APPLICATION....................................................................95
Figure 19-1 JTAG FUNCTIONAL BLOCK DIAGRAM......................................................................100
Figure 19-2 TAP CONTROLLER STATE DIAGRAM........................................................................103
Figure 20-1 IBO BASIC CONFIGURATION USING 4 SCTS............................................................110
Figure 21-1 RECEIVE SIDE D4 TIMING.............................................................................................111
Figure 21-2 RECEIVE SIDE ESF TIMING...........................................................................................112
Figure 21-3 RECEIVE SIDE BOUNDARY TIMING (with elastic store disabled)..............................113
Figure 21-4 RECEIVE SIDE 1.544 MHz BOUNDARY TIMING (with elastic store enabled)...........113
Figure 21-5 RECEIVE SIDE 2.048 MHz BOUNDARY TIMING (with elastic store enabled)...........114
Figure 21-6 RECEIVE SIDE INTERLEAVE BUS OPERATION, BYTE MODE..............................115
Figure 21-7 RECEIVE SIDE INTERLEAVE BUS OPERATION, FRAME MODE...........................116
Figure 21-8 TRANSMIT SIDE D4 TIMING.........................................................................................117
Figure 21-9 TRANSMIT SIDE ESF TIMING.......................................................................................118
Figure 21-10 TRANSMIT SIDE BOUNDARY TIMING (with elastic store disabled)........................119
Figure 21-11 TRANSMIT SIDE 1.544 MHz BOUNDARY TIMING (with elastic store enabled)......119
Figure 21-12 TRANSMIT SIDE 2.048 MHz BOUNDARY TIMING (with elastic store enabled)......120
Figure 21-13 TRANSMIT SIDE INTERLEAVE BUS OPERATION, BYTE MODE.........................121
Figure 21-14 TRANSMIT SIDE INTERLEAVE BUS OPERATION, FRAME MODE .....................122
Figure 22-1 RECEIVE DATA FLOW...................................................................................................123
Figure 22-2 TRANSMIT DATA FLOW................................................................................................124
Figure 24-1 INTEL BUS READ TIMING (BTS=0 / MUX=1).............................................................127
Figure 24-2 INTEL BUS WRITE TIMING (BTS=0 / MUX=1)...........................................................127
Figure 24-3 MOTOROLA BUS TIMING (BTS=1 / MUX=1)..............................................................128
Figure 24-4 INTEL BUS READ TIMING (BTS=0 / MUX=0)..............................................................130
Figure 24-5 INTEL BUS READ TIMING (BTS=0 / MUX=0).............................................................130
Figure 24-6 MOTOROLA BUS READ TIMING (BTS=1 / MUX=0)..................................................131
Figure 24-7 MOTOROLA BUS READ TIMING (BTS=1 / MUX=0)..................................................131
Figure 24-8 RECEIVE SIDE TIMING ..................................................................................................133
Figure 24-9 RECEIVE SIDE TIMING, ELASTIC STORE ENABLED...............................................134
Figure 24-10 RECEIVE LINE INTERFACE TIMING.........................................................................135
Figure 24-11 TRANSMIT SIDE TIMING.............................................................................................137
Figure 24-12 TRANSMIT SIDE TIMING, ELASTIC STORE ENABLED.........................................138
Figure 24-13 TRANSMIT LINE INTERFACE TIMING......................................................................138
相關(guān)PDF資料
PDF描述
DS21352LN 3.3V DS21352 and 5V DS21552 T1 Single-Chip Transceivers
DS21552L 3.3V DS21352 and 5V DS21552 T1 Single-Chip Transceivers
DS21552LN 3.3V DS21352 and 5V DS21552 T1 Single-Chip Transceivers
DS21354 MTTF is frequently used interchangeably with MTBF
DS21354L 3.3V/5V E1 Single-Chip Transceivers
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS21352L+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21352LB 功能描述:網(wǎng)絡(luò)控制器與處理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21352LB+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21352LBN 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
DS21352L-C02 功能描述:網(wǎng)絡(luò)控制器與處理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray