型號(hào) 廠商 描述
m27c512-25f6
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit (64K x8) UV EPROM and OTP EPROM
m27c512-25f6e
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 3300pF; Working Voltage (Vdc)[max]: 50V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1206; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.126" x 0.063"; Container: Bulk; Features: Unmarked
m27c512-25f6f
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25f6tr
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25f6x
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25n1e
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25n1f
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25n1tr
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25n1x
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25n3e
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25n3tr
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 0.033uF; Working Voltage (Vdc)[max]: 25V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1206; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.126" x 0.063"; Container: Bulk; Features: Unmarked
m27c512-25n3x
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25n6e
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25n6f
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 CAP 3.3PF 100V +/-0.25PF NP0(C0G) SMD-1206 TR-7-PL SN-NIBAR
m27c512-25n6tr
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 3.3pF; Working Voltage (Vdc)[max]: 200V; Capacitance Tolerance: +/-0.25pF; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1206; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.126" x 0.063"; Container: Bulk; Features: Unmarked
m27c512-25n6x
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25xb1tr
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25xb1x
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25xb3tr
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25xb3x
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 3.3pF; Working Voltage (Vdc)[max]: 50V; Capacitance Tolerance: +/-0.5pF; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1206; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.126" x 0.063"; Container: Bulk; Features: Unmarked
m27c512-25xb6f
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25xb6tr
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25xb6x
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c1024-12n7x
2 3 4 5 6 7 8 9 10 11 12 13 14 15
意法半導(dǎo)體 1 Mbit 64Kb x16 UV EPROM and OTP EPROM
m27c1024-12n7tr
2 3 4 5 6 7 8 9 10 11 12 13 14 15
意法半導(dǎo)體 1 Mbit 64Kb x16 UV EPROM and OTP EPROM
m50fw080n5g
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 8 Mbit 1Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory
m27c512-45n3f
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 High-Performance IR PIN Photodiode in Subminiature SMT Package
m27c512-60n3f
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 High-Performance IR PIN Photodiode in Subminiature SMT Package, Gullwing, Tape & Reel
m27c512-70n3f
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-80n3f
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-90n3f
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-10n3f
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-12n3f
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-15n3f
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 IR 3/16 Encode/ Decode IC with 16X Clock Generator
m27c512-20n3f
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m27c512-25n3f
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 512 Kbit 64Kb x8 UV EPROM and OTP EPROM
m58wr064eb10zb6t
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 64 Mbit 4Mb x 16, Multiple Bank, Burst 1.8V Supply Flash Memory
m28w320ebb10n1
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 32 Mbit (2Mb x16, Boot Block) 3V Supply Flash Memory
m28w320ebb10n1t
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 32 Mbit (2Mb x16, Boot Block) 3V Supply Flash Memory
m29f100-b70m3tr
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 1 Mbit 128Kb x8 or 64Kb x16, Boot Block Single Supply Flash Memory
m29f100-t90m3tr
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 1 Mbit 128Kb x8 or 64Kb x16, Boot Block Single Supply Flash Memory
m29f100-b90m3tr
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 KK 156 Hdr Assy RtAn Bkwy 5 ckt Tin
m29f100-t120m3tr
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 1 Mbit 128Kb x8 or 64Kb x16, Boot Block Single Supply Flash Memory
m58wr128etzb
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 128 Mbit 8Mb x 16, Multiple Bank, Burst 1.8V Supply Flash Memory
m25p16-vmf6tg
2 3 4 5 6 7
意法半導(dǎo)體 4 Mbit Uniform Sector, Serial Flash Memory
m25p16-vmf6tp
2 3 4 5 6 7
意法半導(dǎo)體 4 Mbit Uniform Sector, Serial Flash Memory
m27c1024-70f7tr
2 3 4 5 6 7 8 9 10 11 12 13 14 15
意法半導(dǎo)體 1 Mbit 64Kb x16 UV EPROM and OTP EPROM
m27c1024-80f7tr
2 3 4 5 6 7 8 9 10 11 12 13 14 15
意法半導(dǎo)體 1 Mbit 64Kb x16 UV EPROM and OTP EPROM
m50fw080k5g
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 8 Mbit 1Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory
m50fw080k5t
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
意法半導(dǎo)體 8 Mbit 1Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory