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參數(shù)資料
| 型號： | CM3121-02SB |
| 廠商： | California Micro Devices Corporation |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | Dual Linear Voltage Regulator for DDR-I and DDR-II Memory |
| 中文描述： | 雙線性穩(wěn)壓器，用于DDR I和DDR - II內(nèi)存 |
| 文件頁數(shù)： | 8/11頁 |
| 文件大?。?/td> | 219K |
| 代理商： | CM3121-02SB |
2004 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
11/12/04
CM3121
PRELIMINARY
Performance Information (cont’d)
Typical Thermal Characteristics
The overall junction to ambient thermal resistance
(
θ
JA
) for device power dissipation (P
D
) consists prima-
rily of two paths in series. The first path is the junction
to the case (
θ
JC
) which is defined by the package style,
and the second path is case to ambient (
θ
CA
) thermal
resistance which is dependent on board layout. The
final operating junction temperature for any set of con-
ditions can be estimated by the following thermal equa-
tion:
T
JUNC
= T
AMB
+ P
D
(
θ
JC
) + P
D
(
θ
CA
)
= T
AMB
+ P
D
(
θ
JA
)
When a CM3121-02SB/SH (PSOP-8) is mounted on a
double-sided printed circuit board with two square
inches of copper allocated for "heat spreading," the
resulting
θ
JA
is 40
°
C/W. Based on the over tempera-
ture limit of 150
°
C with an ambient of 70
°
C, the avail-
able power of this package will be:
P
D
=
= 2W
PCB Layout Considerations
The CM3121-02SB/SH has a heat spreader attached
to the bottom of the PSOP-8 package in order for heat
to be transferred more easily from the package to the
PCB. The heat spreader is a copper pad of dimensions
just smaller than the package itself. By positioning the
matching pad on the PCB top layer to connect to the
spreader during manufacturing, the heat will be trans-
ferred between the two pads. The drawing below
shows the recommended PCB layout. Note that there
are six vias on either side to allow the heat to dissipate
into the ground and power planes on the inner layers of
the PCB. Vias can be placed underneath the chip, but
this can cause blockage of the solder. The ground and
power planes should be at least 2 sq in. of copper by
the vias. It also helps dissipation if the chip is posi-
tioned away from the edge of the PCB, and not near
other heat-dissipating devices. A good thermal link
from the PCB pad to the rest of the PCB will assure the
best heat transfer from the CM3121 package to ambi-
ent,
θ
JA
, of around 40
°
C/W.
Figure 3. Recommended Heat Sink PCB Layout
°
C
40
°
C/ W
70
°
C
–
150
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| CM3121-02SH | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:Dual Linear Voltage Regulator for DDR-I and DDR-II Memory |
| CM313 | 功能描述:LED T3-1/4 MINI BAYONET RoHS:是 類別:光電元件 >> LED - 燈更換 系列:* 標(biāo)準(zhǔn)包裝:100 系列:- 可更換燈:- 尺寸/尺寸:T - 1 3/4 波長:- 正向電壓:28V 底座類型:小型帽沿 顏色:黃 Millicandela 等級:22mcd 配置:單一 應(yīng)用:白熾燈替換件，指示燈 其它名稱:925.0112925.0112-ND |
| CM3131 | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:Triple Linear Voltage Regulator for DDR-I/-II Memory |
| CM3131-01SB | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:Triple Linear Voltage Regulator for DDR-I/-II Memory |
| CM3131-01SH | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:Triple Linear Voltage Regulator for DDR-I/-II Memory |
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