參數(shù)資料
型號: CB55000
英文描述: HCMOS7 STANDARD CELLS
中文描述: HCMOS7標(biāo)準(zhǔn)單元
文件頁數(shù): 10/15頁
文件大?。?/td> 2533K
代理商: CB55000
CB55000 Series
10/15
Figure 6. CB55Q Silicon ring oscillator characterization
6
The CB55000 Series is designed so that it can be made compatible with all types of traditional (PLCCs, PQFPs)
surface mount packages and also more advanced BGAs and Low Profile BGAs. The main packaging options
include:
Plastic Leaded Chip Carriers (PLCC) up to 84 pins, Metric Quad Flat Pack (xQFP) thin and standard, up to 208
pins including high power dissipation versions with slug or spreader.
Ball Grid Array package family:
PACKAGE AVAILABILITY
The diversity in pin count and package style gives the designer the opportunity to find the best compromise for
system size, cost and performances requirements.
Plastic BGA, 1.27mm ball pitch
from 208 to 456 pins
High performance BGA, 1.27mm ball pitch
from 168 to 640 pins
Flip-Chip BGA, 1.27 or 1mm ball pitch
from 352 to1000 pins
Low profile BGA, 1mm ball pitch
from 144 to 256 pins
Low profile Fine pitch BGA. 8mm ball pitch
from 36 to 180 pins
Ultra Fine pitch BGA .5mm ball pitch
from 40 to 304 pins
CB55Q Silicon
Ring Oscillator Characterization
3,00E+01
4,00E+01
5,00E+01
6,00E+01
7,00E+01
8,00E+01
9,00E+01
2,3
2,4
2,5
2,6
2,7
Vdd (Volt)
C
ND2
NR2
IV
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