參數(shù)資料
型號(hào): CB35000
廠商: 意法半導(dǎo)體
英文描述: HCMOS STANDARD CELLS
中文描述: HCMOS標(biāo)準(zhǔn)單元
文件頁(yè)數(shù): 9/16頁(yè)
文件大?。?/td> 166K
代理商: CB35000
9/16
CB35000 SERIES
Ball Grid Array (BGA) packages are available
from 160 to 500 pins and SBC types allow the pin
count to reach the area of 1000 pins. Pin counts
for through board mounting (PGA) range up to
480.
The diversity in pin count and package style gives
the designer the opportunity to find the best
compromise
for
system
performance requirements.
size,
cost
and
All packages for the military market are
hermetically sealed to meet MIL-STD-883
Method. Prototypes are developed in ceramic
packages for fast turnaround evaluation.
H
)
Packages in Production
Packages in Development
NUMBER
OF LEADS
(Pins)
PACKAGE NAME
BGA
PQFP
TQFP
PLCC
CPGA
POWER PQFP
Slug/Spreader
20
28
44
64
68
80
84
100
120
128
144
160
176
180
208
224
225
256
257
304
313
400
480
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
)
)
)
)
)
)
PACKAGE AVAILABILITY
The CB35000 Series is designed to be
compatible with QFP, BGA and SBC package
types, in addition to the more traditional types
found.
The options include Plastic Leaded Chip Carriers
(PLCC) from 28 to 84 pins, while the Metric Quad
Flat Pack (xQFP) offering ranges up to 208 pins.
Both high performance and high power variants
are available as well as the TQFP thin types.
Figure 6
Packaging Capability
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