參數(shù)資料
型號(hào): BUK6211-75C
廠商: NXP SEMICONDUCTORS
元件分類: 功率晶體管
英文描述: N-channel TrenchMOS FET
中文描述: 74 A, 75 V, 0.015 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252
封裝: PLASTIC, SC-63, DPAK-3
文件頁數(shù): 6/15頁
文件大?。?/td> 211K
代理商: BUK6211-75C
BUK6211-75C
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 28 September 2010
6 of 15
NXP Semiconductors
BUK6211-75C
N-channel TrenchMOS FET
6.
Characteristics
Table 6.
Symbol
Static characteristics
V
(BR)DSS
Characteristics
Parameter
Conditions
Min
Typ
Max
Unit
drain-source breakdown
voltage
I
D
= 250 μA; V
GS
= 0 V; T
j
= 25 °C
I
D
= 250 μA; V
GS
= 0 V; T
j
= -55 °C
75
68
1.8
-
-
2.3
-
-
2.8
V
V
V
V
GS(th)
gate-source threshold voltage I
D
= 1 mA; V
DS
= V
GS
; T
j
= 25 °C;
see
Figure 9
; see
Figure 10
I
D
= 1 mA; V
DS
= V
GS
; T
j
= -55 °C;
see
Figure 9
I
D
= 1 mA; V
DS
= V
GS
; T
j
= 175 °C;
see
Figure 9
drain leakage current
V
DS
= 75 V; V
GS
= 0 V; T
j
= 175 °C
V
DS
= 75 V; V
GS
= 0 V; T
j
= 25 °C
gate leakage current
V
DS
= 0 V; V
GS
= 20 V; T
j
= 25 °C
V
DS
= 0 V; V
GS
= -20 V; T
j
= 25 °C
drain-source on-state
resistance
see
Figure 11
V
GS
= 4.5 V; I
D
= 25 A; T
j
= 25 °C;
see
Figure 11
V
GS
= 5 V; I
D
= 25 A; T
j
= 25 °C;
see
Figure 11
V
GS
= 10 V; I
D
= 25 A; T
j
= 175 °C;
see
Figure 12
Dynamic characteristics
Q
G(tot)
total gate charge
-
-
3.3
V
0.8
-
-
V
I
DSS
-
-
-
-
-
-
0.02
5
5
9.3
500
1
100
100
11
μA
μA
nA
nA
m
I
GSS
R
DSon
V
GS
= 10 V; I
D
= 25 A; T
j
= 25 °C;
-
11
15
m
-
10.4
13.2
m
-
-
28.6
m
I
D
= 25 A; V
DS
= 60 V; V
GS
= 5 V;
see
Figure 13
; see
Figure 14
I
D
= 25 A; V
DS
= 60 V; V
GS
= 10 V;
see
Figure 14
; see
Figure 13
I
D
= 25 A; V
DS
= 60 V; V
GS
= 10 V;
see
Figure 13
; see
Figure 14
-
52
-
nC
-
81
-
nC
Q
GS
Q
GD
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
L
D
gate-source charge
gate-drain charge
input capacitance
output capacitance
reverse transfer capacitance
turn-on delay time
rise time
turn-off delay time
fall time
internal drain inductance
-
-
-
-
-
-
-
-
-
-
11
30
3938
310
206
18
40
165
80
3.5
-
-
5251
372
282
-
-
-
-
-
nC
nC
pF
pF
pF
ns
ns
ns
ns
nH
V
GS
= 0 V; V
DS
= 25 V; f = 1 MHz;
T
j
= 25 °C; see
Figure 16
V
DS
= 55 V; R
L
= 2.2
; V
GS
= 10 V;
R
G(ext)
= 10
from upper edge of drain mounting
base to centre of die ; T
j
= 25 °C
from source lead to source bond pad ;
T
j
= 25 °C
L
S
internal source inductance
-
7.5
-
nH
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