參數(shù)資料
型號: BUF11702
英文描述: MULTI CHANNEL LCD GAMMA CORRECTION BUFFER
中文描述: 多通道緩沖液晶伽瑪校正
文件頁數(shù): 21/24頁
文件大?。?/td> 517K
代理商: BUF11702
SLOS359F MARCH 2001 REVISED MAY 2004
www.ti.com
21
REFERENCE VOLTAGES
The reference voltages can be supplied externally via
the connector J2 (not included) or generated onboard
via resistors R
1
to R
11
. An external low side reference
has been provided on the board so that the negative ref-
erences can be referred to a voltage other than ground.
The reference ladder can be referred to either V
DD
(master supply voltage) or a secondary voltage, V
DD2
.
This allows a low noise or absolute reference voltage to
be used for the LCD source driver’s DACs other than
the system voltage. If the secondary voltage is used,
then jumper JP1 should be left open and jumper JP2
shorted. If a ratiometric reference (proportional to the
master supply voltage) is to be used, then jumpers JP1
and JP2 should both be shorted, feeding V
DD
through to
the reference ladder.
OUTPUT
The outputs of the BUF11702 are fed to connector J3
(not mounted). This enables the output voltages to be
monitored directly on the demonstration board or fed
off-board for evaluation in a real system.
Onboard load resistors, R
23
to R
32
, connected to
ground can also be mounted. These can be used to sim-
ulate resistive loading of the LCD source driver.
Transient improving capacitors are frequently used in
LCD panel applications. Therefore, pads to mount
these transient improving capacitors, C
6
to C
16
, have
been included. Due to the possible magnitude of these
capacitors, pads have been placed between the output
of the BUF11702 and these capacitors to mount nulling
resistors, R
12
to R
22
. If the nulling resistors are not re-
quired, shorts could be placed instead of resistors.
The pads for R
1
to R
32
and capacitors C
3
to C
16
have
been laid out to support 0805 or 1206 size components.
PowerPAD
The BUF11702 demonstration board has been laid out
to support the PowerPAD feature of the BUF11702. An
area is provided on the demo board, under the
BUF11702, for the exposed leadframe connection.
Eighteen vias are connected to the ground plane of the
demo board to significantly reduce the thermal case to
ambient resistance,
CA
. See the Applications section
on general PowerPAD design considerations.
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相關代理商/技術參數(shù)
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