參數(shù)資料
型號(hào)： BUF11702
英文描述： MULTI CHANNEL LCD GAMMA CORRECTION BUFFER
中文描述： 多通道緩沖液晶伽瑪校正
文件頁(yè)數(shù)： 18/24頁(yè)
文件大?。?/td> 517K
代理商： BUF11702
SLOS359F MARCH 2001 REVISED MAY 2004
www.ti.com
18
COMPLETE LCD SOLUTION FROM TI
In addition to the BUFxx702 line of gamma correction
buffers, TI offers a complete set of ICs for the LCD panel
market, including source and gate drivers, various
power-supply solutions, and audio power solutions.
Figure 50 shows the total IC solution from TI.
AUDIO POWER AMPLIFIER FOR TV
SPEAKERS
The TPA3002D2 is a 7W (per channel) stereo audio
amplifier specifically targeted towards LCD monitors
and TVs. It offers highly efficient, filter-free Class-D
operation for driving bridgetied stereo speakers. The
TPA3002D2 is designed to drive stereo speakers as low
as 8
without an output filter. The high efficiency of the
TPA3002D2 eliminates the need for external heatsinks
when playing music. Stereo speaker volume is
controlled with a dc voltage applied to the volume
control terminal offering a range of gain from 40dB to
+36dB. Line outputs, for driving external headphone
amplifier inputs, are also dc voltagecontrolled with a
range of gain from 56dB to +20dB. An integrated +5V
regulated supply is provided for powering an external
headphone amplifier. The TPA3002D2 was released to
market in 2002. Texas Instruments offers a full line of
linear and switch-mode audio power amplifiers. For
more information, visit www.ti.com. For excellent audio
performance, TI recommends the OPA364 or OPA353
as headphone drivers.
GENERAL POWERPAD DESIGN
CONSIDERATIONS
The BUF11702 is available in the thermally enhanced
PowerPAD family of packages. These packages are
constructed using a downset leadframe upon which the
die is mounted; see Figures 51(a) and (b). This
arrangement results in the lead frame being exposed as
a thermal pad on the underside of the package; see
Figure 51(c). Due to this thermal pad having direct
thermal contact with the die, excellent thermal
performance is achieved by providing a good thermal
path away from the thermal pad.
The PowerPAD package allows for both assembly and
thermal management in one manufacturing operation.
During the surface-mount solder operation (when the
leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package.
Through the use of thermal paths within this copper
area, heat can be conducted away from the package
into either a ground plane or other heat-dissipating
device. Soldering the PowerPAD to the PCB is always
required, even with applications that have low power
dissipation. This provides the necessary thermal and
mechanical connection between the lead frame die pad
and the PCB.
The PowerPAD must be connected to the device’s most
negative supply voltage.
Figure 50. TI LCD Solution
相關(guān)PDF資料
PDF描述
BUK102-50DL PowerMOS transistor Logic level TOPFET
BUK102-50GL PowerMOS transistor Logic level TOPFET
BUK102-50GS PowerMOS transistor TOPFET
BUK104-50L PowerMOS transistor Logic level TOPFET
BUK104-50LP PowerMOS transistor Logic level TOPFET
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
BUF11702PWP 功能描述:LCD Gamma緩沖器 10+1 Channel High Current Buffer RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
BUF11702PWPG4 功能描述:LCD Gamma緩沖器 10+1 Ch Hi Current Buffer RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
BUF11702PWPR 功能描述:LCD Gamma緩沖器 10+1 Channel High Current Buffer RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
BUF11702PWPRG4 功能描述:LCD Gamma緩沖器 10+1 Channel High Current Buffer RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
BUF11704 制造商:BB 制造商全稱:BB 功能描述:18 - V SUPPLY MULTI - CHANNER GAMMA CORRECTION BUFFER
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