參數(shù)資料
型號(hào)： BUF11702
英文描述： MULTI CHANNEL LCD GAMMA CORRECTION BUFFER
中文描述： 多通道緩沖液晶伽瑪校正
文件頁(yè)數(shù)： 19/24頁(yè)
文件大?。?/td> 517K
代理商： BUF11702
SLOS359F MARCH 2001 REVISED MAY 2004
www.ti.com
19
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
NOTE A:
The thermal pad is electrically isolated from all terminals in the package.
Figure 51. Views of Thermally Enhanced DGN Package
PowerPAD ASSEMBLY PROCESS
1. Prepare the PCB with a top-side etch pattern (see
Pin Configurations). There should be etching for the
leads as well as etch for the thermal pad.
2. Place 18 holes in the area of the thermal pad. These
holes should be 13mils in diameter. Keep them
small, so that solder wicking through the holes is not
a problem during reflow.
3. Additional vias may be placed anywhere along the
thermal plane outside of the thermal pad area. This
helps dissipate the heat generated by the
BUFxx702 IC. These additional vias may be larger
than the 13mil diameter vias directly under the
thermal pad. They can be larger because they are
not in the thermal pad area to be soldered, thus,
wicking is not a problem.
4. Connect all holes to the internal ground plane.
5. When connecting these holes to the ground plane,
do not
use the typical web or spoke via connection
methodology. Web connections have a high thermal
resistance connection that is useful for slowing the
heat transfer during soldering operations. This
makes the soldering of vias that have plane
connections easier. In this application, however, low
thermal resistance is desired for the most efficient
heat transfer. Therefore, the holes under the
BUFxx702 PowerPAD package should make their
connection to the internal ground plane with a
complete
connection
circumference of the plated-through hole.
around
the
entire
6. The top-side solder mask should leave the terminals
of the package and the thermal pad area with its five
holes (dual) or nine holes (quad) exposed. The
bottom-side solder mask should cover the five or
nine holes of the thermal pad area. This prevents
solder from being pulled away from the thermal pad
area during the reflow process.
7. Apply solder paste to the exposed thermal pad area
and all of the IC terminals.
8. With these preparatory steps in place, the
BUFxx702 IC is simply placed in position and run
through the solder reflow operation as any standard
surface-mount component. This preparation results
in a properly installed part.
For a given
JA
, the maximum power dissipation is
shown in Figure 52, and is calculated by the following
formula:
P
D
T
MAX
T
A
JA
Where:
P
D
= maximum power dissipation (W)
T
MAX
= absolute maximum junction temperature (150
°
C)
T
A
= free-ambient air temperature (
°
C)
JA
=
JC
+
CA
JC
= thermal coefficient from junction to case (
°
C/W)
CA
= thermal coefficient from case-to-ambient air (
°
C/W)
7
6
5
4
3
2
40
20
TA Free-Air Temperature
°
C
0
20
40
60
W
M
1
80
100
8
TJ = 125
°
C
0
BUF11702
θ
JA = 27.9
°
C/W
2 oz. Trace and Copper
Pad With Solder
Figure 52. Maximum Power Dissipation vs
Free-Air Temperature
This lower thermal resistance enables the
BUFxx702 to deliver maximum output currents
even at high ambient temperatures.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
BUF11702PWP 功能描述:LCD Gamma緩沖器 10+1 Channel High Current Buffer RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
BUF11702PWPG4 功能描述:LCD Gamma緩沖器 10+1 Ch Hi Current Buffer RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
BUF11702PWPR 功能描述:LCD Gamma緩沖器 10+1 Channel High Current Buffer RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
BUF11702PWPRG4 功能描述:LCD Gamma緩沖器 10+1 Channel High Current Buffer RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
BUF11704 制造商:BB 制造商全稱:BB 功能描述:18 - V SUPPLY MULTI - CHANNER GAMMA CORRECTION BUFFER
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