參數(shù)資料
型號: BCM856BS
廠商: NXP Semiconductors N.V.
元件分類: 功率晶體管
英文描述: PNP-PNP matched double transistors
中文描述: PNP-PNP 匹配雙晶體管
封裝: BCM856BS<SOT363 (TSSOP6)|<<http://www.nxp.com/packages/SOT363.html<1<Always Pb-free,;BCM856DS<SOT457 (TSOP6)|<<http://www.nxp.com/packages/SOT457.html<1<Always Pb-f
文件頁數(shù): 9/14頁
文件大?。?/td> 104K
代理商: BCM856BS
BCM856BS_BCM856DS_1
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 7 August 2008
9 of 14
NXP Semiconductors
BCM856BS; BCM856DS
PNP/PNP matched double transistors
11. Packing information
[1]
For further information and the availability of packing methods, see
Section 15
.
[2]
T1: normal taping
[3]
T2: reverse taping
12. Soldering
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
Package
Description
Packing methods
Packing quantity
3000
10000
-135
-165
-135
-165
-135
-165
-135
-165
BCM856BS
SOT363
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
[2]
-115
[3]
-125
BCM856BS/DG SOT363
[2]
-115
[3]
-125
BCM856DS
SOT457
[2]
-115
[3]
-125
BCM856DS/DG SOT457
[2]
-115
[3]
-125
Fig 13. Reflow soldering footprint SOT363 (SC-88)
solder lands
solder resist
occupied area
solder paste
sot363_fr
2.65
2.35
0.4 (2
×
)
0.6
(2
×
)
0.5
(4
×
)
0.5
(4
×
)
0.6
(4
×
)
0.6
(4
×
)
1.5
1.8
Dimensions in mm
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
BCM856BS,115 功能描述:兩極晶體管 - BJT COMPLEX DISCRETE S2022D/SOT45 RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2
BCM856BS/DG 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:PNP/PNP matched double transistors
BCM856BS/ZLH 功能描述:TRANS 2NPN 45V 0.1A 6TSSOP 制造商:nexperia usa inc. 系列:* 包裝:帶卷(TR) 零件狀態(tài):停產(chǎn) 安裝類型:表面貼裝 封裝/外殼:6-TSSOP,SC-88,SOT-363 供應(yīng)商器件封裝:SC-88-6 標(biāo)準(zhǔn)包裝:10,000
BCM856BS/ZLX 功能描述:TRANS 2NPN 45V 0.1A 6TSSOP 制造商:nexperia usa inc. 系列:* 包裝:帶卷(TR) 零件狀態(tài):停產(chǎn) 安裝類型:表面貼裝 封裝/外殼:6-TSSOP,SC-88,SOT-363 供應(yīng)商器件封裝:SC-88-6 標(biāo)準(zhǔn)包裝:3,000
bcm856bs115 制造商:NXP Semiconductors 功能描述:BJT ARRAY DUAL PNP -65V -10 制造商:NXP Semiconductors 功能描述:BJT ARRAY DUAL PNP -65V -100MA 6-SOT 制造商:NXP 功能描述: