參數(shù)資料
型號(hào)： AXDA2600DKV3D
廠商： ADVANCED MICRO DEVICES INC
元件分類(lèi)： 微控制器/微處理器
英文描述： 2083 MHz, MICROPROCESSOR, CPGA453
封裝： OPGA-453
文件頁(yè)數(shù)： 65/106頁(yè)
文件大?。?/td> 2275K
代理商： AXDA2600DKV3D
Chapter 10
Mechanical Data
49
25175H—March 2003
AMD Athlon XP Processor Model 8 Data Sheet
Preliminary Information
10
Mechanical Data
The AMD Athlon XP processor model 8 connects to the
motherboard through a Pin Grid Array (PGA) socket named
Socket A. This processor utilizes the organic pin grid array
(OPGA) package type described in this chapter. For more
information, see the AMD Athlon Processor-Based Motherboard
Design Guide, order# 24363.
10.1
Die Loading
The processor die on the OPGA package is exposed at the top of
the package. This feature facilitates heat transfer from the die
to an approved heat sink. Any heat sink design should avoid
loads on corners and edges of die. The OPGA package has
compliant pads that serve to bring surfaces in planar contact.
Tool-assisted zero insertion force sockets should be designed so
that no load is placed on the substrate of the package.
Table 20 shows the mechanical loading specifications for the
processor die. It is critical that the mechanical loading of the
heat sink does not exceed the limits shown in Table 20.
Table 20. Mechanical Loading
Location
Dynamic (MAX)
Static (MAX)
Units
Note
Die Surface
100
30
lbf
1
Die Edge
10
lbf
2
Notes:
1. Load specified for coplanar contact to die surface.
2. Load defined for a surface at no more than a two-degree angle of inclination to die surface.
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