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參數(shù)資料
| 型號： | AT91M40008 |
| 廠商： | Atmel Corp. |
| 英文描述： | Incorporates the ARM7TDMI⑩ ARM?? Thumb?? Processor Core |
| 中文描述： | 采用了ARM的ARM7TDMI的⑩？？拇指？？處理器核心 |
| 文件頁數(shù)： | 17/19頁 |
| 文件大?。?/td> | 234K |
| 代理商： | AT91M40008 |
17
AT91R40008
1732CS
–
ATARM
–
02/02
Soldering
Profile
Table 8 gives the recommended soldering profile from J-STD-20.
Small packages may be subject to higher temperatures if they are reflowed in boards with
larger components. In this case, small packages may have to withstand temperatures of up to
235
°
C, not 220
°
C (IR reflow).
Recommended package reflow conditions depend on package thickness and volume. See
Table 9.
When certain small thin packages are used on boards without larger packages, these small
packages may be classified at 220
°
C instead of 235
°
C.
Notes:
1. The packages are qualified by Atmel by using IR reflow conditions, not convection or VPR.
2. By default, the package level 1 is qualified at 220
°
C (unless 235
°
C is stipulated).
3. The body temperature is the most important parameter but other profile parameters such as
total exposure time to hot temperature or heating rate may also influence component
reliability.
A maximum of three reflow passes is allowed per component.
Table 8.
Soldering Profile
Convection or
IR/Convection
VPR
Average Ramp-up Rate (183
°
C to Peak)
3
°
C/sec. max.
10
°
C/sec.
Preheat Temperature 125
°
C ±25
°
C
120 sec. max
Temperature Maintained Above 183
°
C
60 sec. to 150 sec.
Time within 5
°
C of Actual Peak Temperature
10 sec. to 20 sec.
60 sec.
Peak Temperature Range
220 +5/-0
°
C or
235 +5/-0
°
C
215 to 219
°
C or
235 +5/-0
°
C
Ramp-down Rate
6
°
C/sec.
10
°
C/sec.
Time 25
°
C to Peak Temperature
6 min. max
Table 9.
Recommended Package Reflow Conditions
(1, 2, 3)
Parameter
Temperature
Convection
235 +5/-0
°
C
VPR
235 +5/-0
°
C
IR/Convection
235 +5/-0
°
C
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|---|---|
| AT91M40400 | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:AT91 ARM Thumb Microcontrollers |
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| AT91M40400-33AC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microcontroller |
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