參數(shù)資料
型號(hào)： ASDP-21365BBC-1AA
廠商： ANALOG DEVICES INC
元件分類： 數(shù)字信號(hào)處理
英文描述： SHARC Processor
中文描述： 16-BIT, 55.55 MHz, OTHER DSP, PBGA136
封裝： MO-205AE, BGA-136
文件頁數(shù)： 47/52頁
文件大?。?/td> 1320K
代理商： ASDP-21365BBC-1AA
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Rev. A
|
Page 47 of 52
|
December 2006
THERMAL CHARACTERISTICS
The ADSP-2136x processor is rated for performance over the
temperature range specified in Operating Conditions
on Page 16
.
Table 41
and
Table 42
airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6 and the junction-to-
board measurement complies with JESD51-8. Test board and
thermal via design comply with JEDEC standards JESD51-9
(BGA). The junction-to-case measurement complies with MIL-
STD-883. All measurements use a 2S2P JEDEC test board.
Industrial applications using the BGA package require thermal
vias, to an embedded ground plane, in the PCB. Refer to JEDEC
standard JESD51-9 for printed circuit board thermal ball land
and thermal via design information.
To determine the junction temperature of the device while on
the application PCB, use:
where:
T
J
= junction temperature (
°
C)
T
T
= case temperature (
°
C) measured at the top center of the
package
Ψ
JT
= junction-to-top (of package) characterization parameter
is the typical value from
Table 41
.
P
D
= power dissipation (see EE Note No. EE-277 for more
information).
Values of
θ
JA
are provided for package comparison and PCB
design considerations.
Values of
θ
JC
are provided for package comparison and PCB
design considerations when an external heat sink is required.
Note that the thermal characteristics values provided in
Table 41
and
Table 42
are modeled values.
Figure 42. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
LOAD CAPACITANCE (pF)
0
200
50
100
150
10
8
O
6
0
4
2
-
2
Y = 0.0488x
-
1.5923
-
4
T
J
T
T
Ψ
JT
P
D
×
(
)
+
=
Table 41. Thermal Characteristics for BGA (No thermal vias
in PCB)
Parameter
θ
JA
θ
JMA
θ
JMA
θ
JC
Ψ
JT
Ψ
JMT
Ψ
JMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
25.40
21.90
20.90
5.07
0.140
0.330
0.410
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Table 42. Thermal Characteristics for BGA (Thermal vias in
PCB)
Parameter
θ
JA
θ
JMA
θ
JMA
θ
JC
Ψ
JT
Ψ
JMT
Ψ
JMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
23.40
20.00
19.20
5.00
0.130
0.300
0.360
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
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