ProASICPLUS Flash Family FPGAs v5.9 2-27 Package Thermal Characteristics
參數(shù)資料
型號： APA600-CGS624B
廠商： Microsemi SoC
文件頁數(shù)： 110/178頁
文件大?。?/td> 0K
描述： IC FPGA PROASIC+ 600K 624-CGA
標準包裝： 1
系列： ProASICPLUS
RAM 位總計： 129024
輸入/輸出數(shù)： 440
門數(shù)： 600000
電源電壓： 2.3 V ~ 2.7 V
安裝類型： 通孔
封裝/外殼： 624-BCCGA
供應商設備封裝： 624-CCGA（32.5x32.5）
ProASICPLUS Flash Family FPGAs
v5.9
2-27
Package Thermal Characteristics
The ProASICPLUS family is available in several package
types with a range of pin counts. Actel has selected
packages based on high pin count, reliability factors, and
superior thermal characteristics.
Thermal resistance defines the ability of a package to
conduct heat away from the silicon, through the
package to the surrounding air. Junction-to-ambient
thermal resistance is measured in degrees Celsius/Watt
and is represented as Theta ja
(Θja). The lower the
thermal resistance, the more efficiently a package will
dissipate heat.
A package’s maximum allowed power (P) is a function of
maximum junction temperature (TJ), maximum ambient
operating temperature (TA), and junction-to-ambient
thermal resistance Θja. Maximum junction temperature is
the maximum allowable temperature on the active
surface of the integrated circuit (IC) and is 110°C. P is
defined as shown in
EQ 2-4
Θ
ja is a function of the rate (in linear feet per minute
(lfpm)) of airflow in contact with the package. When the
estimated power consumption exceeds the maximum
allowed power, other means of cooling, such as
increasing the airflow rate, must be used. The maximum
power dissipation allowed for a Military temperature
device is specified as a function of Θjc. The absolute
maximum junction temperature is 150°C.
The calculation of the absolute maximum power
dissipation
allowed
for
a
Military
temperature
application is illustrated in the following example for a
456-pin PBGA package:
EQ 2-5
P
T
J
T
A
–
Θ
ja
-----------------
=
Table 2-16 Package Thermal Characteristics
Plastic Packages
Pin Count
θ
jc
θ
ja
Units
Still Air
1.0 m/s
200 ft./min.
2.5 m/s
500 ft./min.
Thin Quad Flat Pack (TQFP)
100
14.0
33.5
27.4
25.0
°C/W
Thin Quad Flat Pack (TQFP)
144
11.0
33.5
28.0
25.7
°C/W
Plastic Quad Flat Pack (PQFP)1
208
8.0
26.1
22.5
20.8
°C/W
PQFP with heat spreader2
208
3.8
16.2
13.3
11.9
°C/W
Plastic Ball Grid Array (PBGA)
456
3.0
15.6
12.5
11.6
°C/W
Fine Pitch Ball Grid Array (FBGA)
144
3.8
26.9
22.9
21.5
°C/W
Fine Pitch Ball Grid Array (FBGA)
256
3.8
26.6
22.8
21.5
°C/W
Fine Pitch Ball Grid Array (FBGA)3
484
3.2
18.0
14.7
13.6
°C/W
Fine Pitch Ball Grid Array (FBGA)4
484
3.2
20.5
17.0
15.9
°C/W
Fine Pitch Ball Grid Array (FBGA)
676
3.2
16.4
13.0
12.0
°C/W
Fine Pitch Ball Grid Array (FBGA)
896
2.4
13.6
10.4
9.4
°C/W
Fine Pitch Ball Grid Array (FBGA)
1152
1.8
12.0
8.9
7.9
°C/W
Ceramic Quad Flat Pack (CQFP)
208
2.0
22.0
19.8
18.0
°C/W
Ceramic Quad Flat Pack (CQFP)
352
2.0
17.9
16.1
14.7
°C/W
Ceramic Column Grid Array (CCGA/LGA)
624
6.5
8.9
8.5
8.0
°C/W
Notes:
1. Valid for the following devices irrespective of temperature grade: APA075, APA150, and APA300
2. Valid for the following devices irrespective of temperature grade: APA450, APA600, APA750, and APA1000
3. Depopulated array
4. Full array
Maximum Power Allowed
Max. junction temp. (
°C) Max. case temp. (°C)
–
θ
jc(°C/W)
-----------------------------------------------------------------------------------------------------------------------------
150
°C125°C
–
3.0
°C/W
----------------------------------------
8.333W
=
相關PDF資料
PDF描述
93AA56C-I/P IC EEPROM 2KBIT 3MHZ 8DIP
93C66CT-I/ST IC EEPROM 4KBIT 3MHZ 8TSSOP
93LC56A-E/SN IC EEPROM 2KBIT 3MHZ 8SOIC
EP2S130F1020I4N IC STRATIX II FPGA 130K 1020FBGA
EP4SE530H35C4N IC STRATIX IV FPGA 530K 1152HBGA
相關代理商/技術(shù)參數(shù)
參數(shù)描述
APA600-CGS624M 制造商:Microsemi Corporation 功能描述:FPGA ProASICPLUS Family 600K Gates 180MHz 0.22um Technology 2.5V 624-Pin CCGA 制造商:Microsemi Corporation 功能描述:APA600-CGS624M - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 440 I/O 624CCGA
APA600-CQ208B 功能描述:IC FPGA PROASIC+ 600K 208-CQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASICPLUS 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應商設備封裝:352-CQFP（75x75）
APA600-CQ208M 制造商:Microsemi Corporation 功能描述:FPGA PROASICPLUS 600K GATES 180MHZ 0.22UM 2.5V 208CQFP - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA PROASIC+ 600K 208CQFP 制造商:Microsemi Corporation 功能描述:IC FPGA 158 I/O 208CQFP
APA600-CQ352B 功能描述:IC FPGA PROASIC+ 600K 352-CQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASICPLUS 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應商設備封裝:352-CQFP（75x75）
APA600-CQ352M 制造商:Microsemi Corporation 功能描述:FPGA PROASICPLUS 600K GATES 180MHZ 0.22UM 2.5V 352CQFP - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 248 I/O 352CQFP
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*