ProASICPLUS Flash Family FPGAs 2- 6 v5.9 Input/Output Blocks To" />
參數(shù)資料
型號: APA150-FG144
廠商: Microsemi SoC
文件頁數(shù): 68/178頁
文件大?。?/td> 0K
描述: IC FPGA PROASIC+ 150K 144-FBGA
標準包裝: 160
系列: ProASICPLUS
RAM 位總計: 36864
輸入/輸出數(shù): 100
門數(shù): 150000
電源電壓: 2.3 V ~ 2.7 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 144-LBGA
供應商設備封裝: 144-FPBGA(13x13)
ProASICPLUS Flash Family FPGAs
2- 6
v5.9
Input/Output Blocks
To meet complex system demands, the ProASICPLUS
family offers devices with a large number of user I/O
pins; up to 712 on the APA1000. Table 2-3 shows the
available supply voltage configurations (the PLL block
uses an independent 2.5 V supply on the AVDD and
AGND pins). All I/Os include ESD protection circuits. Each
I/O has been tested to 2000 V to the human body model
(per JESD22 (HBM)).
Six or seven standard I/O pads are grouped with a GND
pad and either a VDD (core power) or VDDP (I/O power)
pad. Two reference bias signals circle the chip. One
protects the cascaded output drivers, while the other
creates a virtual VDD supply for the I/O ring.
I/O pads are fully configurable to provide the maximum
flexibility and speed. Each pad can be configured as an
input, an output, a tristate driver, or a bidirectional
buffer (Figure 2-6 and Table 2-4).
Table 2-3
ProASICPLUS I/O Power Supply Voltages
VDDP
2.5 V
3.3 V
Input Compatibility
2.5V
3.3V
Output Drive
2.5V
3.3V
Figure 2-6 I/O Block Schematic Representation
3.3 V / 2.5 V
Signal Control
Pull-up
Control
Pad
Y
EN
A
3.3 V / 2.5 V Signal Control Drive
Strength and Slew-Rate Control
Table 2-4
I/O Features
Function
Description
I/O pads configured as inputs
Selectable 2.5 V or 3.3 V threshold levels
Optional pull-up resistor
Optionally configurable as Schmitt trigger input. The Schmitt trigger input option can be
configured as an input only, not a bidirectional buffer. This input type may be slower than
a standard input under certain conditions and has a typical hysteresis of 0.35 V. I/O macros
with an "S" in the standard I/O library have added Schmitt capabilities.
3.3 V PCI Compliant (except Schmitt trigger inputs)
I/O pads configured as outputs
Selectable 2.5 V or 3.3 V compliant output signals
2.5 V – JEDEC JESD 8-5
3.3 V – JEDEC JESD 8-A (LVTTL and LVCMOS)
3.3 V PCI compliant
Ability to drive LVTTL and LVCMOS levels
Selectable drive strengths
Selectable slew rates
Tristate
I/O pads configured as bidirectional
buffers
Selectable 2.5 V or 3.3 V compliant output signals
2.5 V – JEDEC JESD 8-5
3.3 V – JEDEC JESD 8-A (LVTTL and LVCMOS)
3.3 V PCI compliant
Optional pull-up resistor
Selectable drive strengths
Selectable slew rates
Tristate
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相關代理商/技術參數(shù)
參數(shù)描述
APA150-FG144A 功能描述:IC FPGA PROASIC+ 150K 144-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
APA150-FG144I 功能描述:IC FPGA PROASIC+ 150K 144-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
APA150-FG256 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
APA150-FG256A 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
APA150-FG256I 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)