ProASICPLUS Flash Family FPGAs v5.9 2-45 OB33PL 3.3V, High Output Current, Low S" />
<big id="gt10k"><th id="gt10k"><input id="gt10k"></input></th></big>
<ins id="gt10k"><noframes id="gt10k"></noframes></ins>
  • 參數(shù)資料
    型號: APA150-BG456
    廠商: Microsemi SoC
    文件頁數(shù): 130/178頁
    文件大小: 0K
    描述: IC FPGA PROASIC+ 150K 456-PBGA
    標準包裝: 24
    系列: ProASICPLUS
    RAM 位總計: 36864
    輸入/輸出數(shù): 242
    門數(shù): 150000
    電源電壓: 2.3 V ~ 2.7 V
    安裝類型: 表面貼裝
    工作溫度: 0°C ~ 70°C
    封裝/外殼: 456-BBGA
    供應(yīng)商設(shè)備封裝: 456-PBGA(35x35)
    ProASICPLUS Flash Family FPGAs
    v5.9
    2-45
    OB33PL
    3.3V, High Output Current, Low Slew Rate
    2.7
    3.5
    ns
    OB33LH
    3.3V, Low Output Current, High Slew Rate
    2.7
    4.3
    ns
    OB33LN
    3.3V, Low Output Current, Nominal Slew Rate
    3.3
    4.7
    ns
    OB33LL
    3.3V, Low Output Current, Low Slew Rate
    3.3
    6.1
    ns
    Notes:
    1. tDLH = Data-to-Pad High
    2. tDHL = Data-to-Pad Low
    Table 2-34 Worst-Case Military Conditions
    VDDP = 2.3 V, VDD = 2.3V, 35 pF load, TJ = 125°C for Military/MIL-STD-883
    Macro Type
    Description
    Max.
    tDLH
    1
    Max.
    tDHL
    2
    Units
    Std.
    OB25LPHH
    2.5V, Low Power, High Output Current, High Slew Rate3
    2.3
    2.4
    ns
    OB25LPHN
    2.5V, Low Power, High Output Current, Nominal Slew Rate3
    2.7
    3.3
    ns
    OB25LPHL
    2.5V, Low Power, High Output Current, Low Slew Rate3
    3.2
    3.5
    ns
    OB25LPLH
    2.5V, Low Power, Low Output Current, High Slew Rate3
    3.0
    5.0
    ns
    OB25LPLN
    2.5V, Low Power, Low Output Current, Nominal Slew Rate3
    3.9
    4.6
    ns
    OB25LPLL
    2.5V, Low Power, Low Output Current, Low Slew Rate3
    4.3
    5.7
    ns
    Notes:
    1. tDLH = Data-to-Pad High
    2. tDHL = Data-to-Pad Low
    3. Low power I/O work with VDDP = 2.5 V ±10% only. VDDP = 2.3 V for delays.
    Table 2-33 Worst-Case Military Conditions
    VDDP = 3.0V, VDD = 2.3V, 35 pF load, TJ = 125°C for Military/MIL-STD-883
    Macro Type
    Description
    Max.
    tDLH
    1
    Max.
    tDHL
    2
    Units
    Std.
    相關(guān)PDF資料
    PDF描述
    FMC13DREH CONN EDGECARD 26POS .100 EYELET
    APA150-BGG456 IC FPGA PROASIC+ 150K 456-PBGA
    ABM43DTMS CONN EDGECARD 86POS R/A .156 SLD
    APA150-PQG208A IC FPGA PROASIC+ 150K 208-PQFP
    ABM43DTBS CONN EDGECARD 86POS R/A .156 SLD
    相關(guān)代理商/技術(shù)參數(shù)
    參數(shù)描述
    APA150-BG456I 功能描述:IC FPGA PROASIC+ 150K 456-PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
    APA150-BGB 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
    APA150-BGES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
    APA150-BGG456 功能描述:IC FPGA PROASIC+ 150K 456-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
    APA150-BGG456I 功能描述:IC FPGA PROASIC+ 150K 456-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)