參數(shù)資料
型號(hào): AM70PDLI27BDH
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
中文描述: 堆疊式多芯片封裝(MCP / XIP)的快閃記憶體,數(shù)據(jù)存儲(chǔ)的MirrorBit閃存和移動(dòng)存儲(chǔ)芯片(XIP)的
文件頁數(shù): 67/128頁
文件大?。?/td> 916K
代理商: AM70PDLI27BDH
November 25, 2003
Am70PDL127BDH/Am70PDL129BDH
65
A D V A N C E I N F O R M A T I O N
FLASH AC CHARACTERISTICS
OE#
CE#1f
(PDL129 only)
Addresses
V
CC
f
WE#
Data
2AAh
SADD
t
GHWL
t
AH
t
WP
t
WC
t
AS
t
WPH
555h for chip erase
10 for Chip Erase
30h
t
DS
t
VCS
t
CS
t
DH
55h
t
CH
In
Progress
Complete
t
WHWH2
VA
VA
Erase Command Sequence (last two cycles)
Read Status Data
RY/BY#
t
RB
t
BUSY
Notes:
1. SADD = sector address (for Sector Erase), VA = Valid Address for reading status data (see “Flash Write Operation Status”.
2. For PDL129 during CE# transitions the other CE# pin = V
IH
.
Figure 15.
Chip/Sector Erase Operation Timings
相關(guān)PDF資料
PDF描述
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