參數(shù)資料
型號： AM49BDS640AHD8I
廠商： SPANSION LLC
元件分類： 存儲器
英文描述： Stacked Multichip Package (MCP), Flash Memory and pSRAM CMOS 1.8 Volt-only Simultaneous Read/Write
中文描述： SPECIALTY MEMORY CIRCUIT, PBGA89
封裝： 10 X 8 MM, FBGA-89
文件頁數(shù)： 83/84頁
文件大?。?/td> 763K
代理商： AM49BDS640AHD8I
December 5, 2003
Am49BDS640AH
81
A D V A N C E I N F O R M A T I O N
PHYSICAL DIMENSIONS
TLB089—89-ball Fine-Pitch Ball Grid Array (FBGA) 10 x 8 mm Package
3294\ 16-038.22a
PACKAGE
TLB089
JEDEC
N/A
10.00 mm x 8.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.20
PROFILE
A1
0.20
---
---
BALL HEIGHT
A2
0.81
---
0.97
BODY THICKNESS
D
10.00 BSC.
BODY SIZE
E
8.00 BSC.
BODY SIZE
D1
7.20 BSC.
MATRIX FOOTPRINT
E1
7.20 BSC.
MATRIX FOOTPRINT
MD
10
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
φ
b
eE
89
BALL COUNT
0.33
---
0.43
BALL DIAMETER
0.80 BSC
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD / SE
0.40 BSC
SOLDER BALL PLACEMENT
B10,C1,C10,D1,D10,G1,G10
H1,H10,J1,J10
DEPOPULATED SOLDER BALLS
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
10
INDEX MARK
89X
C
0.15
(2X)
(2X)
C
0.15
B
A
6
b
0.20
C
C
0.15
0.08
M
M
C
C
A B
D
E
PIN A1
CORNER
C
TOP VIEW
SIDE VIEW
A2
A1
A
0.08
eD
CORNER
E1
7
SE
D1
A
B
D
C
E
F
H
G
10
8
9
7
5
6
4
2
3
J
K
1
eE
SD
BOTTOM VIEW
PIN A1
7
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AM49BDS640AHD9I 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multichip Package (MCP), Flash Memory and pSRAM CMOS 1.8 Volt-only Simultaneous Read/Write
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