參數(shù)資料
型號(hào)： AM29PL320DB90
廠商： Spansion Inc.
英文描述： 32 Megabit (2 M x 16-Bit/1 M x 32-Bit) CMOS 3.0 Volt-only High Performance Page Mode Flash Memory
中文描述： 32兆位（2米× 16位/ 1個(gè)M × 32位）的CMOS 3.0伏，不僅具備高性能頁(yè)面模式閃存
文件頁(yè)數(shù)： 5/50頁(yè)
文件大?。?/td> 947K
代理商： AM29PL320DB90
October 2, 2003
Am29PL320D
3
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Input Configuration . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . .8
Standard Products .................................................................... 8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . .9
Table 1. Am29PL320D Device Bus Operations ................................9
Word/Double Word Configuration .............................................9
Requirements for Reading Array Data .....................................9
Read Mode ...............................................................................9
Random Read (Non-Page Mode Read) ............................................9
Page Mode Read ....................................................................10
Table 2. Double Word Mode ...........................................................10
Table 3. Word Mode ........................................................................10
Writing Commands/Command Sequences ............................11
Accelerated Program Operation ......................................................11
Program and Erase Operation Status ....................................11
Standby Mode ........................................................................11
Automatic Sleep Mode ...........................................................11
Output Disable Mode ..............................................................11
Table 4. Sector Address Table, Top Boot (Am29PL320DT) ...........12
Table 5. SecSi
Sector Addresses for Top Boot Devices .............12
Table 6. Sector Address Table, Bottom Boot (Am29PL320DB) ......13
Table 7. SecSi
Sector Addresses for
Bottom Boot Devices .......................................................................13
Autoselect Mode .....................................................................14
Table 8. Am29PL320D Autoselect Codes (High Voltage Method) ..14
Sector Protection/Unprotection ...............................................14
Common Flash Memory Interface (CFI) . . . . . . . 15
Table 9. CFI Query Identification String ..........................................15
Table 10. System Interface String ...................................................16
Table 11. Device Geometry Definition ............................................16
Table 12. Primary Vendor-Specific Extended Query ......................17
SecSi
(Secured Silicon) Sector Flash Memory Region .......18
Factory Locked: SecSi Sector Programmed and
Protected At the Factory .................................................................18
Customer Lockable: SecSi Sector NOT Programmed or Locked
At the Factory .................................................................................18
Figure 1. SecSi Sector Protect Verify.............................................. 19
Write Protect (WP#) ................................................................19
Hardware Data Protection ......................................................19
Low V
CC
Write Inhibit ......................................................................19
Write Pulse “Glitch” Protection ........................................................19
Logical Inhibit ..................................................................................19
Power-Up Write Inhibit ....................................................................19
Command Definitions . . . . . . . . . . . . . . . . . . . . . .19
Reading Array Data ................................................................19
Reset Command .....................................................................20
Autoselect Command Sequence ............................................20
Enter SecSi
Sector/Exit SecSi Sector
Command Sequence ..............................................................20
Word/Double Word Program Command Sequence ...............20
Unlock Bypass Command Sequence ..............................................21
Figure 2. Program Operation .......................................................... 21
Chip Erase Command Sequence ...........................................22
Sector Erase Command Sequence ........................................22
Erase Suspend/Erase Resume Commands ...........................22
Figure 3. Erase Operation.............................................................. 23
Temporary Sector Unprotect Enable/Disable
Command Sequence ..............................................................24
Figure 4. Temporary Sector Unprotect Algorithm .......................... 24
Command Definitions ............................................................. 25
Table 13. Command Definitions (Double Word Mode) .................. 25
Table 14. Command Definitions (Word Mode) ............................... 26
Write Operation Status. . . . . . . . . . . . . . . . . . . . . 27
DQ7: Data# Polling .................................................................27
Figure 5. Data# Polling Algorithm .................................................. 27
DQ6: Toggle Bit ......................................................................28
DQ2: Toggle Bit ......................................................................28
Reading Toggle Bits DQ6/DQ2 ...............................................28
DQ5: Exceeded Timing Limits ................................................28
Figure 6. Toggle Bit Algorithm........................................................ 29
DQ3: Sector Erase Timer .......................................................29
Table 15. Write Operation Status ................................................... 30
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 31
Figure 7. Maximum Negative Overshoot Waveform...................... 31
Figure 8. Maximum Positive Overshoot Waveform........................ 31
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 31
Commercial (C) Devices ......................................................... 31
Industrial (I) Devices ............................................................... 31
V
CC
Supply Voltages .............................................................. 31
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 32
CMOS Compatible .................................................................. 32
Zero Power Flash ................................................................... 33
Figure 9. I
CC1
Current vs. Time (Showing Active and Automatic Sleep
Currents)........................................................................................ 33
Figure 10. Typical I
CC1
vs. Frequency........................................... 33
Figure 11. Test Setup..................................................................... 34
Table 16. Test Specifications ......................................................... 34
Key to Switching Waveforms. . . . . . . . . . . . . . . . 34
Figure 12. Input Waveforms and Measurement Levels ................. 34
Read Operations .................................................................... 35
Figure 13. Conventional Read Operations Timings....................... 36
Figure 14. Page Read Timings ...................................................... 36
Double Word/Word Configuration (WORD#) ........................ 37
Figure 15. WORD# Timings for Read Operations.......................... 37
Figure 16. WORD# Timings for Write Operations.......................... 37
Program/Erase Operations .................................................... 38
Figure 17. Program Operation Timings.......................................... 39
Figure 18. AC Waveforms for Chip/Sector Erase Operations........ 40
Figure 19. Data# Polling Timings (During Embedded Algorithms). 40
Figure 20. Toggle Bit Timings (During Embedded Algorithms)...... 41
Figure 21. DQ2 vs. DQ6 for Erase and
Erase Suspend Operations............................................................ 41
Alternate CE# Controlled
Erase/Program Operations ..................................................... 42
Figure 22. Alternate CE# Controlled Write Operation Timings ...... 43
Erase and Programming Performance . . . . . . . 44
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
BGA Package Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 46
FBF084—84-Ball Fine Pitch Ball Grid Array (FBGA) 11 x 12 mm ..... 46
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 47
Revision A (March 7, 2001) ....................................................47
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