參數(shù)資料
型號: AM29PL320DB90
廠商: Spansion Inc.
英文描述: 32 Megabit (2 M x 16-Bit/1 M x 32-Bit) CMOS 3.0 Volt-only High Performance Page Mode Flash Memory
中文描述: 32兆位(2米× 16位/ 1個M × 32位)的CMOS 3.0伏,不僅具備高性能頁面模式閃存
文件頁數(shù): 4/50頁
文件大?。?/td> 947K
代理商: AM29PL320DB90
2
Am29PL320D
October 2, 2003
GENERAL DESCRIPTION
The Am29PL320D is a 32 Mbit, 3.0 Volt-only page
mode Flash memory device organized as 2,097,152
words or 1,048,576 double words. The device is of-
fered in an 84-ball FBGA package. The word-wide
data (x16) appears on DQ15–DQ0; the double word-
wide (x32) data appears on DQ31–DQ0. The device is
available in both top and bottom boot versions. This
device can be programmed in-system or with in stan-
dard EPROM programmers. A 12.0 V V
PP
or 5.0 V
CC
are not required for write or erase operations.
The device offers fast page access times of 20, 25,
and 35 ns, with corresponding random access times of
60, 70, 90 ns, respectively, allowing high speed micro-
processors to operate without wait states. To eliminate
bus contention the device has separate chip enable
(CE#), write enable (WE#), and output enable (OE#)
controls.
Page Mode Features
The device is AC timing, input, output, and package
compatible with 16 Mbit x 16 page mode Mask
ROM
. The page size is 8 words or 4 double words.
After initial page access is accomplished, the page
mode operation provides fast read access speed of
random locations within that page.
Standard Flash Memory Features
The device requires only a
single 3.0 volt power sup-
ply
for both read and write functions. Internally
generated and regulated voltages are provided for the
program and erase operations.
The device is entirely command set compatible with
the
JEDEC single-power-supply Flash standard
.
Commands are written to the command register using
standard microprocessor write timings. Register con-
tents serve as input to an internal state-machine that
controls the erase and programming circuitry. Write cy-
cles also internally latch addresses and data needed
for the programming and erase operations. Reading
data out of the device is similar to reading from other
Flash or EPROM devices.
Device programming occurs by executing the program
command sequence. This initiates the
Embedded
Program
algorithm—an internal algorithm that
automatically times the program pulse widths and
verifies proper cell margin. The
Unlock Bypass
mode
facilitates faster programming times by requiring only
two write cycles to program data instead of four.
Device erasure occurs by executing the erase com-
mand sequence. This initiates the
Embedded Erase
algorithm—an internal algorithm that automatically
preprograms the array (if it is not already programmed)
before executing the erase operation. During erase,
the device automatically times the erase pulse widths
and verifies proper cell margin.
The host system can detect whether a program or
erase operation is complete by reading the DQ7
(Data# Polling) and DQ6 (toggle)
status bits
. After a
program or erase cycle has been completed, the device
is ready to read array data or accept another command.
The
sector erase architecture
allows memory sec-
tors to be erased and reprogrammed without affecting
the data contents of other sectors. The device is fully
erased when shipped from the factory.
Hardware data protection
measures include a low
V
CC
detector that automatically inhibits write opera-
tions during power transitions. The
hardware sector
protection
feature disables both program and erase
operations in any combination of the sectors of mem-
ory. This can be achieved in-system or via
programming equipment.
The
Erase Suspend/Erase Resume
feature enables
the user to put erase on hold for any period of time to
read data from, or program data to, any sector that is
not selected for erasure. True background erase can
thus be achieved.
The device offers two power-saving features. When
addresses have been stable for a specified amount of
time, the device enters the
automatic sleep mode
.
The system can also place the device into the
standby
mode
. Power consumption is greatly reduced in both
these modes.
The
SecSi
Sector
(Secured Silicon) is an extra sec-
tor capable of being permanently locked by AMD or
customers. The
SecSi Indicator Bit
(DQ7) is perma-
nently set to a 1 if the part is
factory
locked
, and set
to a 0 if
customer lockable
. This way, customer lock-
able parts can never be used to replace a factory
locked part.
Current version of device has 512
words (256 double words); future versions will
have only 128 words (64 double words). This
should be considered during system design.
Fac-
tory locked parts can store a secure, random 16 byte
ESN (Electronic Serial Number), customer code (pro-
grammed through AMD’s ExpressFlash service), or
both. Customer Lockable parts may be programmed
after being shipped from AMD.
AMD’s Flash technology combines years of Flash
memory manufacturing experience to produce the
highest levels of quality, reliability and cost effective-
ness. The device electrically erases all bits within a
sector simultaneously via Fowler-Nordheim tunneling.
The data is programmed using hot electron injection.
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AM29PL320DT70 32 Megabit (2 M x 16-Bit/1 M x 32-Bit) CMOS 3.0 Volt-only High Performance Page Mode Flash Memory
AM29PL320DT70R 32 Megabit (2 M x 16-Bit/1 M x 32-Bit) CMOS 3.0 Volt-only High Performance Page Mode Flash Memory
AM29PL320D 32 Megabit (2 M x 16-Bit/1 M x 32-Bit) CMOS 3.0 Volt-only High Performance Page Mode Flash Memory
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