參數(shù)資料
型號： AM29DL640D35EF
廠商： Advanced Micro Devices, Inc.
英文描述： 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory
中文描述： 64兆位（8米× 8位/ 4米x 16位），3.0伏的CMOS只，同步讀/寫閃存
文件頁數(shù)： 5/54頁
文件大?。?/td> 655K
代理商： AM29DL640D35EF
December 13, 2005
Am29DL640D
3
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 6
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 9
Table 1. Am29DL640D Device Bus Operations ................................9
Word/Byte Configuration ........................................ 9
Requirements for Reading Array Data .....................................9
Writing Commands/Command Sequences ............................10
Accelerated Program Operation .............................................10
Autoselect Functions ..............................................................10
Simultaneous Read/Write Operations with Zero Latency .......10
Standby Mode ...................................................... 10
Automatic Sleep Mode ...........................................................11
RESET#: Hardware Reset Pin ...............................................11
Output Disable Mode ..............................................................11
Table 2. Am29DL640D Sector Architecture ....................................11
Table 3. Bank Address ....................................................................14
Secured Silicon Sector Addresses............................. 14
Autoselect Mode ................................................... 14
Table 5. Am29DL640D Autoselect Codes, (High Voltage Method) 15
Sector/Sector Block Protection and Unprotection 16
Table 6. Am29DL640D Boot Sector/Sector Block Addresses for Pro-
tection/Unprotection ........................................................................16
Write Protect (WP#) ................................................................17
Table 7. WP#/ACC Modes ..............................................................17
Temporary Sector Unprotect ..................................................17
Figure 1. Temporary Sector Unprotect Operation........................... 17
Figure 2. In-System Sector Protect/Unprotect Algorithms.............. 18
Secured Silicon Sector
FlashMemoryRegion ............................................................19
Figure 3. Secured Silicon Sector Protect Verify.............................. 20
Hardware Data Protection ......................................................20
Low VCC Write Inhibit ............................................................20
Write Pulse “Glitch” Protection ...............................................20
Logical Inhibit ..........................................................................20
Power-Up Write Inhibit ............................................................20
Common Flash Memory Interface (CFI) . . . . . . .20
Table 8. CFI Query Identification String...................... 21
System Interface String............................................... 21
Table 10. Device Geometry Definition ........................ 22
Table 11. Primary Vendor-Specific Extended Query .. 23
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 24
Reading Array Data ................................................................24
Reset Command .....................................................................24
Autoselect Command Sequence ............................................24
Enter/Exit Secured Silicon Sector
Command Sequence ..............................................................24
Byte/Word Program Command Sequence .............................25
Unlock Bypass Command Sequence .....................................25
Figure 4. Program Operation.......................................................... 26
Chip Erase Command Sequence ...........................................26
Sector Erase Command Sequence ........................................26
Erase Suspend/Erase Resume Commands ...........................27
Figure 5. Erase Operation............................................................... 27
Table 12. Am29DL640D Command Definitions.......... 28
Write Operation Status . . . . . . . . . . . . . . . . . . . . 29
DQ7: Data# Polling .................................................................29
Figure 6. Data# Polling Algorithm.................................................. 29
RY/BY#: Ready/Busy# ......................................... 30
DQ6: Toggle Bit I ....................................................................30
Figure 7. Toggle Bit Algorithm........................................................ 30
DQ2: Toggle Bit II ...................................................................31
Reading Toggle Bits DQ6/DQ2 ...............................................31
DQ5: Exceeded Timing Limits ................................................31
DQ3: Sector Erase Timer .......................................................31
Table 13. Write Operation Status ...................................................32
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 33
Figure 8. Maximum Negative OvershootWaveform...................... 33
Figure 9. Maximum Positive OvershootWaveform........................ 33
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 33
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 10. I
CC1
Current vs. Time (Showing Active and
AutomaticSleepCurrents)............................................................. 35
Figure 11. Typical I
vs. Frequency............................................ 35
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 12. Test Setup.................................................................... 36
KEY TO SWITCHING WAVEFORMS . . . . . . . . . . 36
Figure 13. Input Waveforms and Measurement Levels................. 36
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37
Read-Only Operations ...........................................................37
Figure 14. Read Operation Timings............................................... 37
Hardware Reset (RESET#) ....................................................38
Figure 15. Reset Timings............................................................... 38
Word/Byte Configuration (BYTE#) ..........................................39
Figure 16. BYTE# Timings for Read Operations............................ 39
Figure 17. BYTE# Timings for Write Operations............................ 39
Erase and Program Operations ..............................................40
Figure 18. Program Operation Timings.......................................... 41
Figure 19. Accelerated Program Timing Diagram.......................... 41
Figure 20. Chip/Sector Erase Operation Timings.......................... 42
Figure 21. Back-to-back Read/Write Cycle Timings...................... 43
Figure 22. Data# Polling Timings (During Embedded Algorithms). 43
Figure 23. Toggle Bit Timings (During Embedded Algorithms)...... 44
Figure 24. DQ2 vs. DQ6................................................................. 44
Temporary Sector Unprotect ..................................................45
Figure 25. Temporary Sector Unprotect Timing Diagram.............. 45
Figure 26. Sector/Sector Block Protect and
Unprotect Timing Diagram............................................................. 46
Alternate CE# Controlled Erase and Program Operations .....47
Figure 27. Alternate CE# Controlled Write (Erase/Program)
OperationTimings.......................................................................... 48
Erase And Programming Performance . . . . . . . 49
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 49
TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 49
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 50
FBE063—63-Ball Fine-Pitch Ball Grid Array (FBGA)
12x11mmpackage ..............................................................50
TS 048—48-Pin Standard TSOP ............................................51
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 52
相關(guān)PDF資料
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