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绯诲垪锛� IGLOO PLUS
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RAM 浣嶇附瑷堬細 36864
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宸ヤ綔婧害锛� -40°C ~ 85°C
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IGLOO PLUS Low Power Flash FPGAs
Revision 16
2-11
Table 2-16 Different Components Contributing to the Static Power Consumption in IGLOO PLUS Devices
For IGLOO PLUS V2 or V5 Devices, 1.5 V Core Supply Voltage
Parameter
Definition
Device-Specific Static Power (mW)
AGLP125
AGLP060
AGLP030
PDC1
Array static power in Active mode
PDC2
Array static power in Static (Idle) mode
PDC3
Array static power in Flash*Freeze mode
PDC4
Static PLL contribution
1.841
PDC5
Bank quiescent power (VCCI-dependent)
Notes:
1. This is the minimum contribution of the PLL when operating at lowest frequency.
2. For a different output load, drive strength, or slew rate, Microsemi recommends using the Microsemi power spreadsheet
calculator or the SmartPower tool in Libero SoC software.
Table 2-17 Different Components Contributing to Dynamic Power Consumption in IGLOO PLUS Devices
For IGLOO PLUS V2 Devices, 1.2 V Core Supply Voltage
Parameter
Definition
Device-Specific Dynamic Power
(W/MHz)
AGLP125 AGLP060 AGLP030
PAC1
Clock contribution of a Global Rib
2.874
1.727
0.0001
PAC2
Clock contribution of a Global Spine
1.264
1.244
2.241
PAC3
Clock contribution of a VersaTile row
0.963
0.975
0.981
PAC4
Clock contribution of a VersaTile used as a sequential module
0.098
0.096
PAC5
First contribution of a VersaTile used as a sequential module
0.018
PAC6
Second contribution of a VersaTile used as a sequential module
0.203
PAC7
Contribution of a VersaTile used as a combinatorial module
0.160
0.170
0.158
PAC8
Average contribution of a routing net
0.679
0.686
0.748
PAC9
Contribution of an I/O input pin (standard-dependent)
PAC10
Contribution of an I/O output pin (standard-dependent)
PAC11
Average contribution of a RAM block during a read operation
25.00
PAC12
Average contribution of a RAM block during a write operation
30.00
PAC13
Dynamic contribution for PLL
2.10
Note: 1. There is no Center Global Rib present in AGLP030, and thus it starts directly at the spine resulting in
0W/MHz.
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