參數(shù)資料
型號: AGLP-EVAL-KIT
廠商: Microsemi SoC
文件頁數(shù): 24/27頁
文件大?。?/td> 0K
描述: KIT EVAL HARDWARE FOR AGLP
標(biāo)準(zhǔn)包裝: 1
系列: IGLOO PLUS
類型: FPGA
適用于相關(guān)產(chǎn)品: AGLP125
所含物品: 板,電纜,DVD,跳線,電源,編程器
其它名稱: 1100-1137
6 www.microsemi.com/soc
Extended Temperature Fusion Devices
AFS600
AFS1500
Cortex-M1Devices
M1AFS600
M1AFS1500
System Gates
600,000
1,500,000
Tiles(D–flip–flops)
13,824
38,400
AES-Protected ISP
Yes
PLLs
2
Globals
18
FlashMemoryBlocks(2Mbits)
2
4
TotalFlashMemoryBits
4 M
8 M
FlashROMBits
1,024
RAMBlocks(4,608bits)
24
60
RAM(kbits)
108
270
Analog Quads
10
Analog Input Channels
30
Gate Driver Outputs
10
I/OBanks(+JTAG)
5
Maximum Digital I/Os
172
223
Analog I/Os
40
Package Pins
FG
FG256, FG484
Extended Temperature Fusion
Mixed signal integration at extended temperatures
Microsemi Fusion mixed signal FPGAs integrate configurable analog, large flash memory blocks, comprehensive clock generation and management circuitry and
high-performance, flash-based reprogrammable logic in a monolithic device. Innovative Fusion architecture can be used with Microsemi’s soft microcontroller (MCU)
core as well as the performance-maximized 32-bit ARM Cortex-M1 cores. Extended temperature Fusion devices operate at temperatures from 100C to as low
as -55C.
Extended Temperature Fusion Devices
Extended
Temperature
Fusion
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