Revision 17 2-77 Timing Characteristics 1.5 V DC Core Voltage Table 2-102 RAM4K9
參數(shù)資料
型號: AGLN010V2-UCG36I
廠商: Microsemi SoC
文件頁數(shù): 144/150頁
文件大小: 0K
描述: IC FPGA NANO 1KB 10K 36-UCSP
標(biāo)準(zhǔn)包裝: 714
系列: IGLOO nano
邏輯元件/單元數(shù): 260
輸入/輸出數(shù): 23
門數(shù): 10000
電源電壓: 1.14 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 36-WFBGA,CSBGA
供應(yīng)商設(shè)備封裝: 36-UCSP(3x3)
IGLOO nano Low Power Flash FPGAs
Revision 17
2-77
Timing Characteristics
1.5 V DC Core Voltage
Table 2-102 RAM4K9
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
Std. Units
tAS
Address setup time
0.69
ns
tAH
Address hold time
0.13
ns
tENS
REN, WEN setup time
0.68
ns
tENH
REN, WEN hold time
0.13
ns
tBKS
BLK setup time
1.37
ns
tBKH
BLK hold time
0.13
ns
tDS
Input data (DIN) setup time
0.59
ns
tDH
Input data (DIN) hold time
0.30
ns
tCKQ1
Clock HIGH to new data valid on DOUT (output retained, WMODE = 0)
2.94
ns
Clock HIGH to new data valid on DOUT (flow-through, WMODE = 1)
2.55
ns
tCKQ2
Clock HIGH to new data valid on DOUT (pipelined)
1.51
ns
tC2CWWL1
Address collision clk-to-clk delay for reliable write after write on same address; applicable
to closing edge
0.23
ns
tC2CRWH1
Address collision clk-to-clk delay for reliable read access after write on same address;
applicable to opening edge
0.35
ns
tC2CWRH1
Address collision clk-to-clk delay for reliable write access after read on same address;
applicable to opening edge
0.41
ns
tRSTBQ
RESET Low to data out Low on DOUT (flow-through)
1.72
ns
RESET Low to data out Low on DOUT (pipelined)
1.72
ns
tREMRSTB
RESET removal
0.51
ns
tRECRSTB
RESET recovery
2.68
ns
tMPWRSTB RESET minimum pulse width
0.68
ns
tCYC
Clock cycle time
6.24
ns
FMAX
Maximum frequency
160 MHz
Notes:
1. For more information, refer to the application note Simultaneous Read-Write Operations in Dual-Port SRAM for Flash-
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
相關(guān)PDF資料
PDF描述
ABC40DRAH CONN EDGECARD 80POS .100 R/A DIP
A3PN010-QNG48I IC FPGA NANO 10K GATES 48-QFN
GMC65DRTI-S13 CONN EDGECARD 130POS .100 EXTEND
HBC60DRAN CONN EDGECARD 120PS R/A .100 SLD
HBC60DRAH CONN EDGECARD 120PS R/A .100 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AGLN010V5-QNG48 功能描述:IC FPGA NANO 1KB 10K 48-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
AGLN010V5-QNG48I 功能描述:IC FPGA NANO 1KB 10K 48-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
AGLN010V5-UCG36 功能描述:IC FPGA 10K 1.5V UCG36 RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計:221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA(23x23) 其它名稱:220-1241
AGLN010V5-UCG36I 功能描述:IC FPGA NANO 1KB 10K 36-UCSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
AGLN015V2-QNG68 功能描述:IC FPGA NANO 1KB 15K 68-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)