參數資料
型號: AFE031AIRGZT
廠商: Texas Instruments
文件頁數: 43/57頁
文件大?。?/td> 0K
描述: IC AFE POWERLINE COMM 48VQFN
特色產品: An Intelligent Solar Micro-Inverter Solution
標準包裝: 1
位數: 10
通道數: 1
電壓 - 電源,模擬: 3 V ~ 3.6 V
電壓 - 電源,數字: 3 V ~ 3.6 V
封裝/外殼: 48-VFQFN 裸露焊盤
供應商設備封裝: 48-VQFN 裸露焊盤(7x7)
包裝: 標準包裝
其它名稱: 296-29692-6
35
33
31
29
27
25
23
21
19
17
15
Thermal
Resistance
(°C/W)
0.5
1
1.5
2
2.5
Cu Thickness (oz)
Four-Layer PCB, PCB
Area = 4.32 in , 2 oz Cu
(Results are from thermal
simulations)
2
28
26
24
22
20
18
16
14
12
10
Thermal
Resistance
(°C/W)
2
4
6
8
10
12
14
PCB Area (in )
2
THERMAL RESISTANCE vs BOARD AREA
Four-Layer PCB, 2 oz Cu
(Results are from thermal
simulations)
1
2
3
4
5
6
7
8
Number of Layers
36
34
32
30
28
26
24
22
20
Thermal
Resistance
(
C/W)°
THERMAL RESISTANCE vs NUMBER OF PCB LAYERS
PCB Area = 3 in , 2 oz Cu
(Results are from thermal
simulations)
2
SBOS531D – AUGUST 2010 – REVISED MAY 2012
Increasing the number of layers in the PCB, using thicker copper, and increasing the PCB area are all factors
that improve the spread of heat. Figure 55 through Figure 57, respectively, show thermal resistance performance
as a function of each of these factors.
Figure 55. Thermal Resistance as a Function of the Number of Layers in the PCB
Figure 56. Thermal Resistance as a Function of PCB Area
Figure 57. Thermal Resistance as a Function of Copper Thickness
48
Copyright 2010–2012, Texas Instruments Incorporated
Product Folder Link(s): AFE031
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