At TJ
參數(shù)資料
型號(hào): AFE031AIRGZR
廠商: Texas Instruments
文件頁(yè)數(shù): 2/57頁(yè)
文件大?。?/td> 0K
描述: IC AFE POWERLINE COMM 48VQFN
標(biāo)準(zhǔn)包裝: 2,500
位數(shù): 10
通道數(shù): 1
電壓 - 電源,模擬: 3 V ~ 3.6 V
電壓 - 電源,數(shù)字: 3 V ~ 3.6 V
封裝/外殼: 48-VFQFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 48-VQFN 裸露焊盤(pán)(7x7)
包裝: 帶卷 (TR)
SBOS531D – AUGUST 2010 – REVISED MAY 2012
ELECTRICAL CHARACTERISTICS: Power Supply
At TJ = +25°C, PA_VS = 16 V, VAVDD = VDVDD = 3.3 V, and 10 kΩ connected to PA_ISET (pin 46), unless otherwise noted.
AFE031
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
Operating Supply Range
Power amplifier supply voltage
PA_VS
+7
+24
V
Digital supply voltage
DVDD
+3.0
+3.6
V
Analog supply voltage
AVDD
+3.0
+3.6
V
Quiescent Current
SD pin low
IO = 0, PA = On
(1)
49
61
mA
Power amplifier current
IQPA_VS
IO = 0, PA = Off
(2)
10
μA
Tx configuration(3)
1.2
mA
Digital supply current
IQDVDD
Rx configuration(4)
5
μA
All blocks disabled(5)
5
μA
Tx configuration(3)
2.8
3.7
mA
Analog supply current
IQAVDD
Rx configuration(4)
3.6
5.3
mA
All blocks disabled(5)
30
μA
Shutdown (SD)
Power amplifier supply voltage
PA_VS
SD pin high
75
150
μA
Digital supply voltage
DVDD
SD pin high
5
10
μA
Analog supply voltage
AVDD
SD pin high
15
40
μA
Temperature
Specified range
–40
+125
°C
(1)
Enable1 Register = 00100011, Enable2 Register = 00001110.
(2)
Enable1 Register = 00000100, Enable2 Register = 00000110.
(3)
In the Tx configuration, the following blocks are enabled: DAC, Tx, PA, REF1, and REF2. All other blocks are disabled. Enable1
Register = 00100011, Enable2 Register = 00001110.
(4)
In the Rx configuration, the following blocks are enabled: Rx, REF1, and REF2. All other blocks are disabled. Enable1 Register =
00000100, Enable2 Register = 00000110.
(5)
Enable1 Register = 00000000, Enable2 Register = 00000000.
THERMAL INFORMATION
AFE031
THERMAL METRIC(1)
RGZ (QFN)
UNITS
48 PINS
θJA
Junction-to-ambient thermal resistance
27.8
θJCtop
Junction-to-case (top) thermal resistance
12.1
θJB
Junction-to-board thermal resistance
7.5
°C/W
ψJT
Junction-to-top characterization parameter
0.4
ψJB
Junction-to-board characterization parameter
7.4
θJCbot
Junction-to-case (bottom) thermal resistance
1.7
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
10
Copyright 2010–2012, Texas Instruments Incorporated
Product Folder Link(s): AFE031
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