參數(shù)資料
型號(hào): ADUC832BCPZ-REEL
廠商: Analog Devices Inc
文件頁數(shù): 34/92頁
文件大?。?/td> 0K
描述: IC MCU 62K FLASH ADC/DAC 56LFCSP
標(biāo)準(zhǔn)包裝: 2,500
系列: MicroConverter® ADuC8xx
核心處理器: 8052
芯體尺寸: 8-位
速度: 16MHz
連通性: EBI/EMI,I²C,SPI,UART/USART
外圍設(shè)備: PSM,溫度傳感器,WDT
輸入/輸出數(shù): 34
程序存儲(chǔ)器容量: 62KB(62K x 8)
程序存儲(chǔ)器類型: 閃存
EEPROM 大?。?/td> 4K x 8
RAM 容量: 2.25K x 8
電壓 - 電源 (Vcc/Vdd): 2.7 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x12b,D/A 2x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 56-VFQFN 裸露焊盤,CSP
包裝: 帶卷 (TR)
ADuC832
Data Sheet
Rev. B | Page 4 of 92
REVISION HISTORY
4/13—Rev. A to Rev. B
Updated Outline Dimensions ....................................................... 89
Changes to Ordering Guide .......................................................... 89
9/09—Rev. 0 to Rev. A
Changes to Figure 1.......................................................................... 1
Changed 16.77 MHz to 16.78 MHz Throughout......................... 1
Changes to Reference Input/Output, Output Voltage Parameter,
Endnote 19, and Endnote 20, Table 1 ............................................ 9
Moved Timing Specifications Section ......................................... 10
Changes to Figure 3........................................................................ 10
Changes to Table 3.......................................................................... 11
Changes to Table 4.......................................................................... 12
Changes to Table 5.......................................................................... 13
Changes to Table 11........................................................................ 19
Changes to Figure 15 and Table 13............................................... 21
Changes to Figure 16, Figure 17, Figure 20, and Figure 21....... 26
Added Explanation of Typical Performance Plots Section ....... 30
Changes to Flash/EE Program Memory, Flash/EE Data
Memory, and General-Purpose RAM Sections.......................... 31
Changes to Figure 36...................................................................... 34
Changes to Figure 39 and Figure 40............................................. 39
Changes to Table 20........................................................................ 40
Changes to A Typical DMA Mode Configuration Example
Section.............................................................................................. 41
Changed 16.777216 MHz to 16.78 MHz Throughout .............. 41
Changes to Table 21 ....................................................................... 48
Changes to Using the DAC Section and Figure 52 .................... 52
Changes to Figure 54 Caption ...................................................... 53
Changes to Figure 56...................................................................... 55
Changed 16.77 MHz to 16.78 MHz ............................................. 56
Changes to Figure 60...................................................................... 57
Changes to Table 31 ....................................................................... 63
Deleted Figure 65 and Figure 66; Renumbered Sequentially ... 66
Deleted ASPIRE—IDE Section..................................................... 66
Deleted Figure 67............................................................................ 67
Changes to Table 34 ....................................................................... 67
Changes to Figure 68, Figure 69, Figure 70, and Table 35 ........ 68
Changes to Figure 84...................................................................... 78
Changes to External Memory Interface Section ........................ 82
Changes to Power Supplies Section ............................................. 83
Changes to Table 50 ....................................................................... 84
Changes to Figure 94...................................................................... 86
Changes to Single-Pin Emulation Mode Section....................... 87
Changes to QuickStart Development System Section and
QuickStart Plus Development System Section........................... 88
Updated Outline Dimensions....................................................... 89
Changes to Ordering Guide.......................................................... 89
11/02—Revision 0: Initial Version
相關(guān)PDF資料
PDF描述
ATSAM3A8CA-AU IC MCU 2X256KB CORTEX-M3 100-QFP
NS5B1G384DTT1G IC ANLG SWITCH SPST NC SC-70-5
M74VHC1GT66DFT2G IC SWITCH SPST SOT353
ADUC824BCPZ IC MCU 8K FLASH ADC/DAC 56LFCSP
IDTQS4A215Q1G8 IC MUX/DEMUX DUAL 4X1 48QVSOP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADUC832BS 制造商:Analog Devices 功能描述:MCU 8-Bit ADuC8xx 8052 CISC 62KB Flash 3.3V/5V 52-Pin MQFP 制造商:Rochester Electronics LLC 功能描述:8BIT CISC 62KB FLASH 16.78MHZ 3.3/5V 52MQFP - Bulk 制造商:Analog Devices 功能描述:8BIT MCU +12BIT ADC LQFP52 832
ADUC832BS-REEL 制造商:Analog Devices 功能描述:MCU 8-Bit ADuC8xx 8052 CISC 62KB Flash 3.3V/5V 52-Pin MQFP T/R
ADUC832BSZ 功能描述:IC ADC/DAC 12BIT W/MCU 52MQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:MicroConverter® ADuC8xx 標(biāo)準(zhǔn)包裝:250 系列:56F8xxx 核心處理器:56800E 芯體尺寸:16-位 速度:60MHz 連通性:CAN,SCI,SPI 外圍設(shè)備:POR,PWM,溫度傳感器,WDT 輸入/輸出數(shù):21 程序存儲(chǔ)器容量:40KB(20K x 16) 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:6K x 16 電壓 - 電源 (Vcc/Vdd):2.25 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 6x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:48-LQFP 包裝:托盤 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323
ADUC832BSZ-REEL 功能描述:IC MCU 62K FLASH ADC/DAC 52MQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:MicroConverter® ADuC8xx 標(biāo)準(zhǔn)包裝:38 系列:Encore!® XP® 核心處理器:eZ8 芯體尺寸:8-位 速度:5MHz 連通性:IrDA,UART/USART 外圍設(shè)備:欠壓檢測/復(fù)位,LED,POR,PWM,WDT 輸入/輸出數(shù):16 程序存儲(chǔ)器容量:4KB(4K x 8) 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:1K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:20-SOIC(0.295",7.50mm 寬) 包裝:管件 其它名稱:269-4116Z8F0413SH005EG-ND
ADUC832QS-U1 制造商:Analog Devices 功能描述:EVAL KIT - Bulk